TS391SNL500C Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 197.67 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details TS391SNL500C Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Cartridge, 17.64 oz (500g), Mesh Type: 4, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C), Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.
Weitere Produktangebote TS391SNL500C
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
TS391SNL500C | Hersteller : Chip Quik | Solder Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5 |
Produkt ist nicht verfügbar |