Technische Details TS991AX500T4 Chip Quik
Description: SOLDER PASTE THERMALLY STABLE NC, Shelf Life: 12 Months, Shelf Life Start: Date of Manufacture, Part Status: Active, Flux Type: No-Clean, Process: Leaded, Mesh Type: 4, Form: Jar, 17.64 oz (500g), Melting Point: 361°F (183°C), Type: Solder Paste, Composition: Sn63Pb37 (63/37), Packaging: Bulk.
Weitere Produktangebote TS991AX500T4
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
TS991AX500T4 | Chip Quik Inc. |
 Description: SOLDER PASTE THERMALLY STABLE NCShelf Life: 12 Months Shelf Life Start: Date of Manufacture Part Status: Active Flux Type: No-Clean Process: Leaded Mesh Type: 4 Form: Jar, 17.64 oz (500g) Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| TS991AX500T4 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: SOLDER PASTE THERMALLY STABLE NC
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Flux Type: No-Clean
Process: Leaded
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH