Technische Details TS991AX500T4 Chip Quik
Description: SOLDER PASTE THERMALLY STABLE NC, Shelf Life: 12 Months, Shelf Life Start: Date of Manufacture, Part Status: Active, Flux Type: No-Clean, Process: Leaded, Mesh Type: 4, Form: Jar, 17.64 oz (500g), Melting Point: 361°F (183°C), Type: Solder Paste, Composition: Sn63Pb37 (63/37), Packaging: Bulk.
Weitere Produktangebote TS991AX500T4
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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TS991AX500T4 | Hersteller : Chip Quik Inc. |
 Description: SOLDER PASTE THERMALLY STABLE NCShelf Life: 12 Months Shelf Life Start: Date of Manufacture Part Status: Active Flux Type: No-Clean Process: Leaded Mesh Type: 4 Form: Jar, 17.64 oz (500g) Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Bulk |
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