TS991SNL500T3 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
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Technische Details TS991SNL500T3 Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423°F (217°C), Form: Jar, 17.64 oz (500g), Mesh Type: 3, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.
Weitere Produktangebote TS991SNL500T3 nach Preis ab 244.79 EUR bis 244.79 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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TS991SNL500T3 | Chip Quik |
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar) |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
|
| TS991SNL500T3 |
|
Hersteller: Chip Quik
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar)
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar)
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 244.79 EUR |