TS991SNL500T4 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Melting Point: 423°F (217°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
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Technische Details TS991SNL500T4 Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC, Shelf Life: 12 Months, Shelf Life Start: Date of Manufacture, Part Status: Active, Flux Type: No-Clean, Process: Lead Free, Mesh Type: 4, Form: Jar, 17.64 oz (500g), Melting Point: 423°F (217°C), Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Packaging: Bulk.
Weitere Produktangebote TS991SNL500T4
| Foto | Bezeichnung | Hersteller | Beschreibung |
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Preis |
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TS991SNL500T4 | Hersteller : Chip Quik |
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar) |
Produkt ist nicht verfügbar |