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TSM-115-01-S-DV-P

TSM-115-01-S-DV-P Samtec Inc.


tsm.pdf Hersteller: Samtec Inc.
Description: CONN HEADER SMD 30POS 2.54MM
Features: Pick and Place
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
auf Bestellung 181 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+8.46 EUR
Mindestbestellmenge: 15
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details TSM-115-01-S-DV-P Samtec Inc.

Description: CONN HEADER SMD 30POS 2.54MM, Features: Pick and Place, Packaging: Tube, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).

Weitere Produktangebote TSM-115-01-S-DV-P nach Preis ab 13.62 EUR bis 15.38 EUR

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TSM-115-01-S-DV-P TSM-115-01-S-DV-P Hersteller : Samtec Inc. tsm.pdf Description: CONN HEADER SMD 30POS 2.54MM
Features: Pick and Place
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.38 EUR
25+14.78 EUR
50+14.31 EUR
100+13.62 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
TSM-115-01-S-DV-P TSM-115-01-S-DV-P Hersteller : Samtec tsm.pdf Headers & Wire Housings .100" Surface Mount Terminal Strip
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