TSM-130-03-S-SH-LC Samtec Inc.

Description: CONN HEADER SMD R/A 30POS 2.54MM, Contact Length - Mating: 0.420" (10.67mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.120" (3.05mm), Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 1, Number of Positions: 30, Mounting Type: Surface Mount, Right Angle, Connector Type: Header, Features: Board Lock, Packaging: Tube.