TW-T150-01-10 3G Shielding Specialties LP
Hersteller: 3G Shielding Specialties LP
Description: THERM PAD 300MMX200MM PINK
Part Status: Active
Backing, Carrier: Fiberglass
Thermal Conductivity: 1.5W/m-K
Outline: 300.00mm x 200.00mm
Usage: Multi
Type: Gap Filler Pad, Sheet
Thickness: 0.0394" (1.000mm)
Material: Silicone Elastomer
Color: Pink
Packaging: Sheet
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Technische Details TW-T150-01-10 3G Shielding Specialties LP
Description: THERM PAD 300MMX200MM PINK, Part Status: Active, Backing, Carrier: Fiberglass, Thermal Conductivity: 1.5W/m-K, Outline: 300.00mm x 200.00mm, Usage: Multi, Type: Gap Filler Pad, Sheet, Thickness: 0.0394" (1.000mm), Material: Silicone Elastomer, Color: Pink, Packaging: Sheet.

