TZ325C529I3 Efinix, Inc.
Hersteller: Efinix, Inc.
Description: FPGA TOPAZ 326KLE 529FBGA
Packaging: Tray
Package / Case: 529-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 326080
Supplier Device Package: 529-FBGA (19x19)
Total RAM Bits: 20153631
Number of I/O: 227
Description: FPGA TOPAZ 326KLE 529FBGA
Packaging: Tray
Package / Case: 529-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 326080
Supplier Device Package: 529-FBGA (19x19)
Total RAM Bits: 20153631
Number of I/O: 227
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 264.84 EUR |
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Technische Details TZ325C529I3 Efinix, Inc.
Description: FPGA TOPAZ 326KLE 529FBGA, Packaging: Tray, Package / Case: 529-BGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.92V ~ 0.98V, Number of Logic Elements/Cells: 326080, Supplier Device Package: 529-FBGA (19x19), Total RAM Bits: 20153631, Number of I/O: 227.