Technische Details US1010 UNISEM
Description: REPCO AB MOVABLE CONTACT X-33553, Part Status: Active, Package Accepted: Non Specific, Proto Board Type: Through Hole to SIP, Board Thickness: 0.031" (0.79mm) 1/32", Number of Positions: 10, Material: FR4 Epoxy Glass, Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm), Packaging: Bag.
Weitere Produktangebote US1010
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
US-1010 | Capital Advanced Technologies |
 Description: REPCO AB MOVABLE CONTACT X-33553Part Status: Active Package Accepted: Non Specific Proto Board Type: Through Hole to SIP Board Thickness: 0.031" (0.79mm) 1/32" Number of Positions: 10 Material: FR4 Epoxy Glass Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm) Packaging: Bag |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| US-1010 |
|
Hersteller: Capital Advanced Technologies
Description: REPCO AB MOVABLE CONTACT X-33553
Part Status: Active
Package Accepted: Non Specific
Proto Board Type: Through Hole to SIP
Board Thickness: 0.031" (0.79mm) 1/32"
Number of Positions: 10
Material: FR4 Epoxy Glass
Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm)
Packaging: Bag
Description: REPCO AB MOVABLE CONTACT X-33553
Part Status: Active
Package Accepted: Non Specific
Proto Board Type: Through Hole to SIP
Board Thickness: 0.031" (0.79mm) 1/32"
Number of Positions: 10
Material: FR4 Epoxy Glass
Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm)
Packaging: Bag
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH