V-1102-SMD/A-L Assmann WSW Components
Hersteller: Assmann WSW ComponentsDescription: HEATSINK TO-263 19.38X25.40MM
Packaging: Bulk
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 4754 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 7+ | 2.52 EUR |
| 10+ | 2.24 EUR |
| 25+ | 2.13 EUR |
| 50+ | 2.06 EUR |
| 100+ | 1.98 EUR |
| 250+ | 1.89 EUR |
| 500+ | 1.82 EUR |
| 1000+ | 1.75 EUR |
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Technische Details V-1102-SMD/A-L Assmann WSW Components
Description: HEATSINK TO-263 19.38X25.40MM, Packaging: Bulk, Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Attachment Method: SMD Pad, Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM, Thermal Resistance @ Natural: 11.00°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote V-1102-SMD/A-L
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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V-1102-SMD/A-L | Hersteller : Assmann WSW Components GMBH |
FINGER-SHAPED SMD-HEATSINK |
Produkt ist nicht verfügbar |