V-1102-SMD/A-L Assmann WSW Components
Hersteller: Assmann WSW Components
Description: HEATSINK TO-263 19.38X25.40MM
Packaging: Bulk
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
| Anzahl | Preis |
|---|---|
| 8+ | 2.45 EUR |
| 10+ | 2.18 EUR |
| 25+ | 2.07 EUR |
| 50+ | 2 EUR |
| 100+ | 1.92 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.77 EUR |
| 1000+ | 1.7 EUR |
| 5000+ | 1.56 EUR |
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Technische Details V-1102-SMD/A-L Assmann WSW Components
Description: HEATSINK TO-263 19.38X25.40MM, Packaging: Bulk, Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Attachment Method: SMD Pad, Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM, Thermal Resistance @ Natural: 11.00°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.

