W25Q64FWXGAQ Winbond Electronics
Hersteller: Winbond Electronics
Description: IC FLASH 64MBIT SPI/QUAD 8XSON
Packaging: Tube
Package / Case: 8-XDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 1.95V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-XSON (4x4)
Part Status: Obsolete
Write Cycle Time - Word, Page: 60µs, 5ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 64MBIT SPI/QUAD 8XSON
Packaging: Tube
Package / Case: 8-XDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 1.95V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-XSON (4x4)
Part Status: Obsolete
Write Cycle Time - Word, Page: 60µs, 5ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 8M x 8
DigiKey Programmable: Not Verified
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Technische Details W25Q64FWXGAQ Winbond Electronics
Description: IC FLASH 64MBIT SPI/QUAD 8XSON, Packaging: Tube, Package / Case: 8-XDFN Exposed Pad, Mounting Type: Surface Mount, Memory Size: 64Mbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 105°C (TA), Voltage - Supply: 1.65V ~ 1.95V, Technology: FLASH - NOR, Clock Frequency: 104 MHz, Memory Format: FLASH, Supplier Device Package: 8-XSON (4x4), Part Status: Obsolete, Write Cycle Time - Word, Page: 60µs, 5ms, Memory Interface: SPI - Quad I/O, QPI, Access Time: 6 ns, Memory Organization: 8M x 8, DigiKey Programmable: Not Verified.