W63AH2NBVACI TR Winbond Electronics
Hersteller: Winbond ElectronicsDescription: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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Technische Details W63AH2NBVACI TR Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA, Packaging: Tape & Reel (TR), Package / Case: 178-VFBGA, Mounting Type: Surface Mount, Memory Size: 1Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 85°C (TC), Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR3, Clock Frequency: 933 MHz, Memory Format: DRAM, Supplier Device Package: 178-VFBGA (11x11.5), Write Cycle Time - Word, Page: 15ns, Memory Interface: HSUL_12, Access Time: 5.5 ns, Memory Organization: 32M x 32, DigiKey Programmable: Not Verified.
Weitere Produktangebote W63AH2NBVACI TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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W63AH2NBVACI TR | Hersteller : Winbond |
DRAM 1Gb LPDDR3, x32, 933MHz, Industrial Temp, T&R |
Produkt ist nicht verfügbar |