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W66CL2NQUAFJ Winbond

xlxnx_lpddr4_wfbga200_sdp_ddp_datasheet_a01-003_20190918.pdf Hersteller: Winbond
DRAM Chip Mobile LPDDR4 SDRAM 4Gbit 128Mx32 1.1V/1.8V 200-Pin WFBGA
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Technische Details W66CL2NQUAFJ Winbond

Description: IC DRAM 4GBIT LVSTL 11 200WFBGA, Packaging: Tray, Package / Case: 200-WFBGA, Mounting Type: Surface Mount, Memory Size: 4Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 105°C (TC), Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR4, Clock Frequency: 1.6 GHz, Memory Format: DRAM, Supplier Device Package: 200-WFBGA (10x14.5), Write Cycle Time - Word, Page: 18ns, Memory Interface: LVSTL_11, Access Time: 3.5 ns, Memory Organization: 128M x 32, DigiKey Programmable: Not Verified.

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W66CL2NQUAFJ W66CL2NQUAFJ Hersteller : Winbond Electronics W66xLxNx_LPDDR4_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH