W66CQ2NQUAFJ Winbond Electronics
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
| Anzahl | Preis |
|---|---|
| 2+ | 16.33 EUR |
| 10+ | 15.03 EUR |
| 25+ | 14.71 EUR |
| 40+ | 14.66 EUR |
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Technische Details W66CQ2NQUAFJ Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA, Packaging: Tray, Package / Case: 200-WFBGA, Mounting Type: Surface Mount, Memory Size: 4Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 105°C (TC), Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR4X, Clock Frequency: 2.133 GHz, Memory Format: DRAM, Supplier Device Package: 200-WFBGA (10x14.5), Part Status: Active, Memory Interface: LVSTL_11, Access Time: 3.5 ns, Memory Organization: 128M x 32, DigiKey Programmable: Not Verified.
Weitere Produktangebote W66CQ2NQUAFJ nach Preis ab 63.69 EUR bis 63.69 EUR
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W66CQ2NQUAFJ | Hersteller : Winbond |
DRAM 4Gb LPDDR4X, DDP, x32, 1600MHz, -40C 105C |
auf Bestellung 128 Stücke: Lieferzeit 10-14 Tag (e) |
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| W66CQ2NQUAFJ | Hersteller : Winbond |
DRAM Chip Mobile LPDDR4X SDRAM 4Gbit 128Mx32 1.1V/1.8V |
Produkt ist nicht verfügbar |