WAVE-23-125 Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 23X23X12.5MM
Packaging: Bulk
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Angled Fins
Type: Board Level
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Clip
Thermal Resistance @ Forced Air Flow: 6.76°C/W @ 200 LFM
Fin Height: 0.492" (12.50mm)
Material Finish: Black Anodized
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.91 EUR |
| 10+ | 6.13 EUR |
| 25+ | 5.83 EUR |
| 50+ | 5.63 EUR |
| 100+ | 5.41 EUR |
| 250+ | 5.16 EUR |
| 500+ | 4.97 EUR |
| 1000+ | 4.8 EUR |
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Technische Details WAVE-23-125 Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 23X23X12.5MM, Packaging: Bulk, Material: Aluminum Alloy, Length: 0.906" (23.00mm), Shape: Square, Angled Fins, Type: Board Level, Width: 0.906" (23.00mm), Package Cooled: BGA, Attachment Method: Clip, Thermal Resistance @ Forced Air Flow: 6.76°C/W @ 200 LFM, Fin Height: 0.492" (12.50mm), Material Finish: Black Anodized.
Weitere Produktangebote WAVE-23-125 nach Preis ab 5.32 EUR bis 8.08 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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WAVE-23-125 | Wakefield-Vette |
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x12.5mm, Wave Series |
auf Bestellung 816 Stücke: Lieferzeit 10-14 Tag (e) |
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WAVE-23-125 | Wakefield Thermal |
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x12.5mm, Wave Series |
auf Bestellung 103 Stücke: Lieferzeit 10-14 Tag (e) |
|
| WAVE-23-125 |
|
Hersteller: Wakefield-Vette
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x12.5mm, Wave Series
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x12.5mm, Wave Series
auf Bestellung 816 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 7.75 EUR |
| 10+ | 7.54 EUR |
| 25+ | 7.35 EUR |
| 100+ | 6.53 EUR |
| 250+ | 6.12 EUR |
| 500+ | 5.76 EUR |
| 1000+ | 5.32 EUR |
| WAVE-23-125 |
|
Hersteller: Wakefield Thermal
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x12.5mm, Wave Series
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x12.5mm, Wave Series
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 8.08 EUR |
| 10+ | 7.54 EUR |
| 25+ | 7.35 EUR |
| 50+ | 6.94 EUR |
| 100+ | 6.53 EUR |
| 250+ | 6.12 EUR |
| 500+ | 5.93 EUR |