WAVE-23-165 Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 23X23X16.5MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.650" (16.51mm)
Thermal Resistance @ Forced Air Flow: 5.08°C/W @ 200 LFM
Attachment Method: Clip
Package Cooled: BGA
Width: 0.906" (23.00mm)
Type: Board Level
Shape: Square, Angled Fins
Length: 0.906" (23.00mm)
Material: Aluminum Alloy
Packaging: Bulk
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.31 EUR |
| 10+ | 6.47 EUR |
| 25+ | 6.16 EUR |
| 50+ | 5.94 EUR |
| 100+ | 5.72 EUR |
| 250+ | 5.45 EUR |
| 500+ | 5.26 EUR |
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Technische Details WAVE-23-165 Wakefield Thermal Solutions
Description: ANCHOR HEATSINK 23X23X16.5MM, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.650" (16.51mm), Thermal Resistance @ Forced Air Flow: 5.08°C/W @ 200 LFM, Attachment Method: Clip, Package Cooled: BGA, Width: 0.906" (23.00mm), Type: Board Level, Shape: Square, Angled Fins, Length: 0.906" (23.00mm), Material: Aluminum Alloy, Packaging: Bulk.
Weitere Produktangebote WAVE-23-165 nach Preis ab 6.06 EUR bis 8.35 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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WAVE-23-165 | Wakefield Thermal |
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x16.5mm, Wave Series |
auf Bestellung 469 Stücke: Lieferzeit 10-14 Tag (e) |
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| WAVE-23-165 |
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Hersteller: Wakefield Thermal
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x16.5mm, Wave Series
Heat Sinks Low Profile Heat Sink BGA Chipset Aluminum Top Mount, 23x23x16.5mm, Wave Series
auf Bestellung 469 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 8.35 EUR |
| 10+ | 7.41 EUR |
| 25+ | 7.08 EUR |
| 50+ | 6.76 EUR |
| 100+ | 6.58 EUR |
| 250+ | 6.24 EUR |
| 500+ | 6.06 EUR |