WCI2012CPR27GDG

WCI2012CPR27GDG INPAQ Technology Co., Ltd


WCI2012CP Series.pdf Hersteller: INPAQ Technology Co., Ltd
Description: CHIP IND 2012,270NH,G,48Q,0.35A,
Packaging: Cut Tape (CT)
Tolerance: ±2%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 1.15Ohm Max
Q @ Freq: 48 @ 250MHz
Frequency - Self Resonant: 650MHz
Material - Core: Ceramic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.060" (1.52mm)
Inductance: 270 nH
Current Rating (Amps): 350 mA
auf Bestellung 15000 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
77+0.23 EUR
98+ 0.18 EUR
106+ 0.17 EUR
120+ 0.15 EUR
137+ 0.13 EUR
250+ 0.12 EUR
500+ 0.11 EUR
1000+ 0.088 EUR
Mindestbestellmenge: 77
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Technische Details WCI2012CPR27GDG INPAQ Technology Co., Ltd

Description: CHIP IND 2012,270NH,G,48Q,0.35A,, Packaging: Cut Tape (CT), Tolerance: ±2%, Package / Case: 0805 (2012 Metric), Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 1.15Ohm Max, Q @ Freq: 48 @ 250MHz, Frequency - Self Resonant: 650MHz, Material - Core: Ceramic, Inductance Frequency - Test: 100 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.060" (1.52mm), Inductance: 270 nH, Current Rating (Amps): 350 mA.