WS991LT35T4 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 68.97 EUR |
5+ | 63.23 EUR |
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Technische Details WS991LT35T4 Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS, Packaging: Bulk, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 280°F (138°C), Form: Syringe, 1.23 oz (34.869g), Mesh Type: 4, Flux Type: Water Soluble, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C), Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.
Weitere Produktangebote WS991LT35T4
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
WS991LT35T4 | Hersteller : Chip Quik | Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn42/Bi57.6/Ag0.4 T4 (35g syrin |
Produkt ist nicht verfügbar |