WS991SNL500T4 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
| Anzahl | Preis |
|---|---|
| 1+ | 159.56 EUR |
| 5+ | 137.49 EUR |
| 10+ | 128.93 EUR |
| 25+ | 118.39 EUR |
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Technische Details WS991SNL500T4 Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423°F (217°C), Form: Jar, 17.64 oz (500g), Mesh Type: 4, Process: Lead Free, Flux Type: Water Soluble, Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.
Weitere Produktangebote WS991SNL500T4
| Foto | Bezeichnung | Hersteller | Beschreibung |
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Preis |
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WS991SNL500T4 | Hersteller : Chip Quik |
Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar |
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