WS991SNL500T4 Chip Quik
Hersteller: Chip Quik
Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar
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Technische Details WS991SNL500T4 Chip Quik
Description: SOLDER PASTE THERMALLY STABLE WS, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423°F (217°C), Form: Jar, 17.64 oz (500g), Mesh Type: 4, Process: Lead Free, Flux Type: Water Soluble, Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.
Weitere Produktangebote WS991SNL500T4 nach Preis ab 277.34 EUR bis 277.34 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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WS991SNL500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE WS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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| WS991SNL500T4 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 277.34 EUR |