X2000H Lumissil Microsystems

Description: MULTI-CPU HETEROGENEOUS MULTI-AP, Packaging: Tape & Reel (TR), Package / Case: 270-TFBGA, Mounting Type: Surface Mount, Speed: 1.2GHz, Operating Temperature: -40°C ~ 85°C (TA), Core Processor: XBurst® 2, Voltage - I/O: 1.8V, 3.3V, Supplier Device Package: 270-BGA (12x12), Ethernet: 10/100/1000Mbps (1), USB: USB 2.0 OTG (1), Number of Cores/Bus Width: 2 Core, 32-Bit, RAM Controllers: LPDDR3, Graphics Acceleration: No, Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI, Security Features: AES, RSA, TRNG, MD5, SHA, SHA2, Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG.