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X66AK2H12XAAW2 Texas Instruments


66ak2h06.pdf
Hersteller: Texas Instruments
Description: IC DSP ARM SOC BGA
Part Status: Discontinued at Digi-Key
Supplier Device Package: 1517-FCBGA (40x40)
Clock Rate: 1.2GHz
Voltage - Core: Variable
Voltage - I/O: 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
On-Chip RAM: 12.75MB
Non-Volatile Memory: ROM (384kB)
Operating Temperature: 0°C ~ 85°C (TC)
Type: DSP+ARM®
Interface: EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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Technische Details X66AK2H12XAAW2 Texas Instruments

Description: IC DSP ARM SOC BGA, Part Status: Discontinued at Digi-Key, Supplier Device Package: 1517-FCBGA (40x40), Clock Rate: 1.2GHz, Voltage - Core: Variable, Voltage - I/O: 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V, On-Chip RAM: 12.75MB, Non-Volatile Memory: ROM (384kB), Operating Temperature: 0°C ~ 85°C (TC), Type: DSP+ARM®, Interface: EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0, Mounting Type: Surface Mount, Package / Case: 1517-BBGA, FCBGA, Packaging: Tray.