XB3-C-GM1-UT-101 Digi
Hersteller: DigiDescription: RF TXRX MOD BT/CELL CHIP+U.FLTH
Packaging: Bag
Package / Case: 20-DIP Module
Sensitivity: -113dBm
Mounting Type: Through Hole
Memory Size: 1MB Flash, 64kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V ~ 4.3V
Power - Output: 23dBm
Data Rate: 1Mbps
Protocol: Bluetooth, GNSS, LTE
Current - Transmitting: 200mA ~ 270mA
Antenna Type: Integrated, Chip + U.FL
Utilized IC / Part: ME310-W1
RF Family/Standard: Bluetooth, Cellular, Navigation
Serial Interfaces: I2C, JTAG, SPI, UART, USB
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 124.04 EUR |
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Technische Details XB3-C-GM1-UT-101 Digi
Description: RF TXRX MOD BT/CELL CHIP+U.FLTH, Packaging: Bag, Package / Case: 20-DIP Module, Sensitivity: -113dBm, Mounting Type: Through Hole, Memory Size: 1MB Flash, 64kB RAM, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3.3V ~ 4.3V, Power - Output: 23dBm, Data Rate: 1Mbps, Protocol: Bluetooth, GNSS, LTE, Current - Transmitting: 200mA ~ 270mA, Antenna Type: Integrated, Chip + U.FL, Utilized IC / Part: ME310-W1, RF Family/Standard: Bluetooth, Cellular, Navigation, Serial Interfaces: I2C, JTAG, SPI, UART, USB.
Weitere Produktangebote XB3-C-GM1-UT-101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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XB3-C-GM1-UT-101 | Hersteller : DIGI |
Multiprotocol Modules Digi XBee 3 Low-Power LTE-M/NB-IoT, GNSS, Telit ME310G1-W1, AT&T SIM |
Produkt ist nicht verfügbar |