Technische Details XC3S4000-5FGG900C AMD / Xilinx
Description: IC FPGA 633 I/O 900FBGA, Packaging: Tray, Package / Case: 900-BBGA, Mounting Type: Surface Mount, Number of Gates: 4000000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 62208, Supplier Device Package: 900-FBGA (31x31), Number of LABs/CLBs: 6912, Total RAM Bits: 1769472, Number of I/O: 633, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC3S4000-5FGG900C nach Preis ab 567.48 EUR bis 567.48 EUR
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XC3S4000-5FGG900C | Hersteller : AMD |
 Description: IC FPGA 633 I/O 900FBGAPackaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 4000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 62208 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 6912 Total RAM Bits: 1769472 Number of I/O: 633 DigiKey Programmable: Not Verified |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC3S4000-5FGG900C | Hersteller : XILINX |
0813+ BGA |
auf Bestellung 75 Stücke: Lieferzeit 21-28 Tag (e) |