Produkte > AMD > XC6SLX75-N3FG676C
XC6SLX75-N3FG676C

XC6SLX75-N3FG676C AMD


ds162 Hersteller: AMD
Description: IC FPGA 408 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 408
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details XC6SLX75-N3FG676C AMD

Description: IC FPGA 408 I/O 676FCBGA, Packaging: Tray, Package / Case: 676-BGA, Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 74637, Supplier Device Package: 676-FBGA (27x27), Number of LABs/CLBs: 5831, Total RAM Bits: 3170304, Number of I/O: 408, DigiKey Programmable: Not Verified.