Produkte > AMD > XCKU19P-L1FFVB2104I
XCKU19P-L1FFVB2104I

XCKU19P-L1FFVB2104I AMD

ds890-ultrascale-overview Hersteller: AMD
Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details XCKU19P-L1FFVB2104I AMD

Description: IC FPGA KINTEX UP LP 2104FCBGA, Packaging: Tray, Package / Case: 2104-BBGA, FCBGA, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 100°C (TJ), Voltage - Supply: 0.698V ~ 0.742V, Number of Logic Elements/Cells: 1842750, Supplier Device Package: 2104-FCBGA (47.5x47.5), Number of LABs/CLBs: 105300, Total RAM Bits: 63753421, Number of I/O: 540, DigiKey Programmable: Not Verified.