Produkte > AMD > XCVU33P-3FSVH2104E

XCVU33P-3FSVH2104E AMD

GnuVZDIoTcrlIuu8Aok5XQ Hersteller: AMD
Description: IC FPGA 208 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 961800
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 54960
Total RAM Bits: 24746394
Number of I/O: 208
DigiKey Programmable: Not Verified
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Technische Details XCVU33P-3FSVH2104E AMD

Description: IC FPGA 208 I/O 2104FCBGA, Packaging: Tray, Package / Case: 2104-BBGA, FCBGA, Mounting Type: Surface Mount, Operating Temperature: 0°C ~ 100°C (TJ), Voltage - Supply: 0.873V ~ 0.927V, Number of Logic Elements/Cells: 961800, Supplier Device Package: 2104-FCBGA (47.5x47.5), Number of LABs/CLBs: 54960, Total RAM Bits: 24746394, Number of I/O: 208, DigiKey Programmable: Not Verified.