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Technische Details XCZU9EG-2FFVC900I AMD / Xilinx
Description: IC SOC CORTEX-A53 900FCBGA, Architecture: MCU, FPGA, Supplier Device Package: 900-FCBGA (31x31), Peripherals: DMA, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells, Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, Operating Temperature: -40°C ~ 100°C (TJ), RAM Size: 256KB, Speed: 533MHz, 600MHz, 1.3GHz, Package / Case: 900-BBGA, FCBGA, Packaging: Tray.
Weitere Produktangebote XCZU9EG-2FFVC900I nach Preis ab 10039.36 EUR bis 10344.91 EUR
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XCZU9EG-2FFVC900I | AMD |
 Description: IC SOC CORTEX-A53 900FCBGAArchitecture: MCU, FPGA Supplier Device Package: 900-FCBGA (31x31) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 900-BBGA, FCBGA Packaging: Tray |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU9EG-2FFVC900I | Xilinx |
SoC FPGA XCZU9EG-2FFVC900I |
auf Bestellung 4 Stücke: Lieferzeit 641-645 Tag (e) |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 900FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 900-FCBGA (31x31)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 900-BBGA, FCBGA
Packaging: Tray
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 10039.36 EUR |
| XCZU9EG-2FFVC900I |
|
Hersteller: Xilinx
SoC FPGA XCZU9EG-2FFVC900I
SoC FPGA XCZU9EG-2FFVC900I
auf Bestellung 4 Stücke:
Lieferzeit 641-645 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 10344.91 EUR |