XIAO ESP32C3 SEEED STUDIO
Hersteller: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Operating temperature: -40...85°C
Communictions protocol: WIFI
Bluetooth version: 5.0
Number of pins: 2x 7
Dimensions: 21x17.5mm
Kit contents: prototype board; u.FL antenna
Kind of connector: solder pads; U.FL; USB C socket
Manufacturer series: XIAO
Kind of architecture: RISC-V
Type of development kit: evaluation
Components: ESP32-C3
Memory: 400kB SRAM; 4MB FLASH
WiFi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Operating temperature: -40...85°C
Communictions protocol: WIFI
Bluetooth version: 5.0
Number of pins: 2x 7
Dimensions: 21x17.5mm
Kit contents: prototype board; u.FL antenna
Kind of connector: solder pads; U.FL; USB C socket
Manufacturer series: XIAO
Kind of architecture: RISC-V
Type of development kit: evaluation
Components: ESP32-C3
Memory: 400kB SRAM; 4MB FLASH
WiFi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
auf Bestellung 75 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 7.28 EUR |
| 11+ | 6.71 EUR |
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Technische Details XIAO ESP32C3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Operating temperature: -40...85°C, Communictions protocol: WIFI, Bluetooth version: 5.0, Number of pins: 2x 7, Dimensions: 21x17.5mm, Kit contents: prototype board; u.FL antenna, Kind of connector: solder pads; U.FL; USB C socket, Manufacturer series: XIAO, Kind of architecture: RISC-V, Type of development kit: evaluation, Components: ESP32-C3, Memory: 400kB SRAM; 4MB FLASH, WiFi: 2,4GHz, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote XIAO ESP32C3 nach Preis ab 6.71 EUR bis 7.28 EUR
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XIAO ESP32C3 | Hersteller : SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO Interface: ADC; GPIO; I2C; I2S; SPI; UART Operating temperature: -40...85°C Communictions protocol: WIFI Bluetooth version: 5.0 Number of pins: 2x 7 Dimensions: 21x17.5mm Kit contents: prototype board; u.FL antenna Kind of connector: solder pads; U.FL; USB C socket Manufacturer series: XIAO Kind of architecture: RISC-V Type of development kit: evaluation Components: ESP32-C3 Memory: 400kB SRAM; 4MB FLASH WiFi: 2,4GHz |
auf Bestellung 75 Stücke: Lieferzeit 14-21 Tag (e) |
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