XIAO ESP32C3 SEEED STUDIO
Hersteller: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Kit contents: prototype board; u.FL antenna
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Kit contents: prototype board; u.FL antenna
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
auf Bestellung 89 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10+ | 7.24 EUR |
| 11+ | 6.95 EUR |
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Technische Details XIAO ESP32C3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO, Type of development kit: evaluation, Bluetooth version: 5.0, Kit contents: prototype board; u.FL antenna, Components: ESP32-C3, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Kind of connector: solder pads; U.FL; USB C socket, Communictions protocol: WIFI, Manufacturer series: XIAO, Number of pins: 2x 7, Kind of architecture: RISC-V, Operating temperature: -40...85°C, Memory: 400kB SRAM; 4MB FLASH, Dimensions: 21x17.5mm, WiFi: 2,4GHz, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote XIAO ESP32C3 nach Preis ab 6.95 EUR bis 7.24 EUR
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XIAO ESP32C3 | Hersteller : SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board; u.FL antenna Components: ESP32-C3 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: RISC-V Operating temperature: -40...85°C Memory: 400kB SRAM; 4MB FLASH Dimensions: 21x17.5mm WiFi: 2,4GHz |
auf Bestellung 89 Stücke: Lieferzeit 14-21 Tag (e) |
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