XIAO ESP32S3 SEEED STUDIO
Hersteller: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Kit contents: prototype board; u.FL antenna
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Kit contents: prototype board; u.FL antenna
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Anzahl je Verpackung: 1 Stücke
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Technische Details XIAO ESP32S3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO, Type of development kit: evaluation, Bluetooth version: 5.0, Kit contents: prototype board; u.FL antenna, Components: ESP32-S3R8, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Kind of connector: solder pads; U.FL; USB C socket, Communictions protocol: WIFI, Manufacturer series: XIAO, Number of pins: 2x 7, Kind of architecture: Xtensa LX7, Operating temperature: -40...65°C, Memory: 8MB FLASH; 8MB SRAM, Dimensions: 21x17.5mm, WiFi: 2,4GHz, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote XIAO ESP32S3
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XIAO ESP32S3 | Hersteller : SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Kit contents: prototype board; u.FL antenna Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz |
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