XIAO ESP32S3 SEEED STUDIO
Hersteller: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Operating temperature: -40...65°C
Communictions protocol: WIFI
Bluetooth version: 5.0
Manufacturer series: XIAO
Dimensions: 21x17.5mm
Number of pins: 2x 7
Memory: 8MB FLASH; 8MB SRAM
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
Components: ESP32-S3R8
Kind of architecture: Xtensa LX7
Type of development kit: evaluation
Kind of connector: solder pads; U.FL; USB C socket
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Operating temperature: -40...65°C
Communictions protocol: WIFI
Bluetooth version: 5.0
Manufacturer series: XIAO
Dimensions: 21x17.5mm
Number of pins: 2x 7
Memory: 8MB FLASH; 8MB SRAM
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
Components: ESP32-S3R8
Kind of architecture: Xtensa LX7
Type of development kit: evaluation
Kind of connector: solder pads; U.FL; USB C socket
auf Bestellung 40 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 12.23 EUR |
| 7+ | 11.77 EUR |
| 10+ | 11.3 EUR |
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Technische Details XIAO ESP32S3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Operating temperature: -40...65°C, Communictions protocol: WIFI, Bluetooth version: 5.0, Manufacturer series: XIAO, Dimensions: 21x17.5mm, Number of pins: 2x 7, Memory: 8MB FLASH; 8MB SRAM, WiFi: 2,4GHz, Kit contents: prototype board; u.FL antenna, Components: ESP32-S3R8, Kind of architecture: Xtensa LX7, Type of development kit: evaluation, Kind of connector: solder pads; U.FL; USB C socket.