XL25W-12-12-10 t-Global Technology
Hersteller: t-Global Technology
Description: CERAMIC HEAT SINK 12X12X10MM WHI
Packaging: Bulk
Material: Ceramic
Length: 0.472" (12.00mm)
Shape: Square
Type: Heat Spreader
Width: 0.472" (12.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape
Fin Height: 0.394" (10.00mm)
Part Status: Active
Description: CERAMIC HEAT SINK 12X12X10MM WHI
Packaging: Bulk
Material: Ceramic
Length: 0.472" (12.00mm)
Shape: Square
Type: Heat Spreader
Width: 0.472" (12.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape
Fin Height: 0.394" (10.00mm)
Part Status: Active
auf Bestellung 1290 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
9+ | 2.09 EUR |
10+ | 1.99 EUR |
25+ | 1.94 EUR |
50+ | 1.89 EUR |
100+ | 1.78 EUR |
250+ | 1.68 EUR |
500+ | 1.57 EUR |
1000+ | 1.47 EUR |
Produktrezensionen
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Technische Details XL25W-12-12-10 t-Global Technology
Description: CERAMIC HEAT SINK 12X12X10MM WHI, Packaging: Bulk, Material: Ceramic, Length: 0.472" (12.00mm), Shape: Square, Type: Heat Spreader, Width: 0.472" (12.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Fin Height: 0.394" (10.00mm), Part Status: Active.