XR2A-0802 Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC DivDescription: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Wire Wrap
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 29.5µin (0.75µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 379 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 8.87 EUR |
| 10+ | 8.05 EUR |
| 25+ | 7.62 EUR |
| 50+ | 7.44 EUR |
| 100+ | 7.09 EUR |
| 250+ | 6.2 EUR |
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Technische Details XR2A-0802 Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Wire Wrap, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 29.5µin (0.75µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2A-0802
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
XR2A-0802 | Hersteller : Omron Electronics |
IC & Component Sockets Socket Wrap Term 8P 7.62mm .75AuPlate |
auf Bestellung 78 Stücke: Lieferzeit 14-28 Tag (e) |