XR2A-0811-N Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC DivDescription: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 1705 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 3.15 EUR |
| 10+ | 2.67 EUR |
| 25+ | 2.56 EUR |
| 50+ | 2.5 EUR |
| 100+ | 2.4 EUR |
| 250+ | 2.18 EUR |
| 500+ | 1.96 EUR |
| 1000+ | 1.74 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details XR2A-0811-N Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2A-0811-N
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
XR2A-0811-N | Hersteller : OMRON ELECTRONIC COMPONENTS |
Description: OMRON ELECTRONIC COMPONENTS - XR2A-0811-N - DIP SOCKET, GOLD, 8POS, 2.54MM, TH tariffCode: 85366930 productTraceability: Yes-Date/Lot Code Kontaktüberzug: Gold Plated Contacts Steckverbindertyp: DIP Socket rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Kontaktmaterial: Beryllium Copper hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES directShipCharge: 25 usEccn: EAR99 Produktpalette: XR2 Series SVHC: To Be Advised |
auf Bestellung 157 Stücke: Lieferzeit 14-21 Tag (e) |
|
 |
XR2A-0811-N | Hersteller : Omron Electronics |
IC & Component Sockets Socket DIP Term 8P 7.62mm .25AuPlate |
auf Bestellung 940 Stücke: Lieferzeit 14-28 Tag (e) |
|
 |
XR2A0811N | Hersteller : Omron |
Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |