 
XR2A-0811-N Omron Electronics Inc-EMC Div
 Hersteller: Omron Electronics Inc-EMC Div
                                                Hersteller: Omron Electronics Inc-EMC DivDescription: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 496 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis | 
|---|---|
| 7+ | 2.55 EUR | 
| 10+ | 1.95 EUR | 
| 25+ | 1.75 EUR | 
| 60+ | 1.58 EUR | 
| 120+ | 1.47 EUR | 
| 300+ | 1.33 EUR | 
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Technische Details XR2A-0811-N Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active. 
Weitere Produktangebote XR2A-0811-N
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis | 
|---|---|---|---|---|---|
|   | XR2A-0811-N | Hersteller : OMRON ELECTRONIC COMPONENTS |  Description: OMRON ELECTRONIC COMPONENTS - XR2A-0811-N - DIP SOCKET, GOLD, 8POS, 2.54MM, TH tariffCode: 85366930 productTraceability: Yes-Date/Lot Code Kontaktüberzug: Gold Plated Contacts Steckverbindertyp: DIP Socket rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Kontaktmaterial: Beryllium Copper hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES directShipCharge: 25 usEccn: EAR99 Produktpalette: XR2 Series SVHC: To Be Advised | auf Bestellung 157 Stücke:Lieferzeit 14-21 Tag (e) | |
|   | XR2A-0811-N | Hersteller : Omron Electronics |  IC & Component Sockets Socket DIP Term 8P 7.62mm .25AuPlate | auf Bestellung 940 Stücke:Lieferzeit 10-14 Tag (e) | |
|   | XR2A0811N | Hersteller : Omron |  Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole | Produkt ist nicht verfügbar |