auf Bestellung 200 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 55+ | 2.69 EUR |
| 58+ | 2.50 EUR |
| 100+ | 2.32 EUR |
Produktrezensionen
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Technische Details XR2A-0815 Omron
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote XR2A-0815 nach Preis ab 2.58 EUR bis 3.17 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||
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XR2A-0815 | Hersteller : Omron Electronics |
 IC & Component Sockets 8P IC SOCKET LOW PROFILE |
auf Bestellung 107 Stücke: Lieferzeit 10-14 Tag (e) |
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| XR2A-0815 | Hersteller : Omron Electronics Inc-EMC Div |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
auf Bestellung 118 Stücke: Lieferzeit 10-14 Tag (e) |
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XR2A-0815 | Hersteller : Omron |
Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |