XR2A-1401-N Omron Electronics
| Anzahl | Preis |
|---|---|
| 1+ | 4.44 EUR |
| 10+ | 4.03 EUR |
| 25+ | 3.82 EUR |
| 34+ | 3.71 EUR |
| 102+ | 3.54 EUR |
| 272+ | 3.1 EUR |
| 510+ | 3.01 EUR |
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Technische Details XR2A-1401-N Omron Electronics
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 29.5µin (0.75µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote XR2A-1401-N nach Preis ab 3.37 EUR bis 4.66 EUR
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XR2A-1401-N | Omron Electronics Inc-EMC Div |
 Description: CONN IC DIP SOCKET 14POS GOLDPackaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5µin (0.75µm) Contact Material - Post: Beryllium Copper |
auf Bestellung 266 Stücke: Lieferzeit 10-14 Tag (e) |
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| XR2A-1401-N |
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Hersteller: Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 29.5µin (0.75µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 29.5µin (0.75µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 4.66 EUR |
| 10+ | 3.97 EUR |
| 34+ | 3.64 EUR |
| 68+ | 3.47 EUR |
| 102+ | 3.37 EUR |