XR2A-1401-N Omron Electronics
auf Bestellung 413 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
8+ | 6.55 EUR |
10+ | 5.95 EUR |
25+ | 5.64 EUR |
34+ | 5.49 EUR |
102+ | 5.23 EUR |
272+ | 4.58 EUR |
510+ | 4.45 EUR |
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Technische Details XR2A-1401-N Omron Electronics
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 29.5µin (0.75µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote XR2A-1401-N nach Preis ab 4.53 EUR bis 6.68 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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XR2A-1401-N | Hersteller : Omron Electronics Inc-EMC Div |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 29.5µin (0.75µm) Contact Material - Post: Beryllium Copper |
auf Bestellung 568 Stücke: Lieferzeit 21-28 Tag (e) |
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XR2A-1401-N | Hersteller : Omron | Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |