XR2A-1611-N Omron Electronics
auf Bestellung 424 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 6.24 EUR |
| 10+ | 5.25 EUR |
| 120+ | 4.97 EUR |
| 270+ | 4.34 EUR |
| 510+ | 4.24 EUR |
| 1020+ | 3.59 EUR |
| 2520+ | 3.35 EUR |
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Technische Details XR2A-1611-N Omron Electronics
Description: CONN IC DIP SOCKET 16POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2A-1611-N nach Preis ab 4.26 EUR bis 6.27 EUR
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XR2A-1611-N | Hersteller : Omron Electronics Inc-EMC Div |
 Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 515 Stücke: Lieferzeit 21-28 Tag (e) |
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