| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.9 EUR |
| 10+ | 4.37 EUR |
| 30+ | 4.32 EUR |
| 120+ | 4.12 EUR |
| 270+ | 3.69 EUR |
| 510+ | 3.33 EUR |
| 1020+ | 3.2 EUR |
Artikel auf Bestellung
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Lieferzeit:
10-14 Tag (e)
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Technische Details XR2A-1611-N Aratas
Description: CONN IC DIP SOCKET 16POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2A-1611-N nach Preis ab 2.8 EUR bis 5.26 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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XR2A-1611-N | Omron Electronics |
 IC & Component Sockets Socket DIP Term 16P 7.62mm .25AuPlate |
auf Bestellung 109 Stücke: Lieferzeit 10-14 Tag (e) |
|
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XR2A-1611-N | Omron Electronics Inc-EMC Div |
Description: CONN IC DIP SOCKET 16POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 371 Stücke: Lieferzeit 10-14 Tag (e) |
|
| XR2A-1611-N |
|
Hersteller: Omron Electronics
IC & Component Sockets Socket DIP Term 16P 7.62mm .25AuPlate
IC & Component Sockets Socket DIP Term 16P 7.62mm .25AuPlate
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.97 EUR |
| 10+ | 4.21 EUR |
| 30+ | 3.69 EUR |
| 60+ | 3.56 EUR |
| 120+ | 3.02 EUR |
| 270+ | 2.87 EUR |
| 1020+ | 2.8 EUR |
| XR2A-1611-N |
|
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 371 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.26 EUR |
| 10+ | 4.46 EUR |
| 30+ | 4.13 EUR |
| 60+ | 3.94 EUR |
| 120+ | 3.75 EUR |
| 270+ | 3.53 EUR |