XR2A-2411-N Omron Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 8.04 EUR |
| 10+ | 6.53 EUR |
| 20+ | 6.22 EUR |
| 260+ | 5.59 EUR |
| 500+ | 5.46 EUR |
| 1000+ | 4.96 EUR |
| 2500+ | 4.71 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details XR2A-2411-N Omron Electronics
Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote XR2A-2411-N nach Preis ab 5.57 EUR bis 10 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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XR2A-2411-N | Aratas |
 IC & Component Sockets Socket DIP Term 24P 15.24mm .25AuPlate |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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XR2A-2411-N | Omron Electronics Inc-EMC Div |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper |
auf Bestellung 98 Stücke: Lieferzeit 10-14 Tag (e) |
|
| XR2A-2411-N |
|
Hersteller: Aratas
IC & Component Sockets Socket DIP Term 24P 15.24mm .25AuPlate
IC & Component Sockets Socket DIP Term 24P 15.24mm .25AuPlate
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 8.85 EUR |
| 10+ | 7.16 EUR |
| 60+ | 6.62 EUR |
| 100+ | 6.39 EUR |
| 260+ | 5.99 EUR |
| 500+ | 5.71 EUR |
| 1000+ | 5.57 EUR |
| XR2A-2411-N |
|
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
auf Bestellung 98 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10 EUR |
| 20+ | 7.07 EUR |
| 40+ | 6.54 EUR |
| 60+ | 6.26 EUR |