XR2A-2411-N Omron Electronics
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 6.76 EUR |
| 10+ | 5.49 EUR |
| 20+ | 5.23 EUR |
| 260+ | 4.7 EUR |
| 500+ | 4.59 EUR |
| 1000+ | 4.17 EUR |
| 2500+ | 3.96 EUR |
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Technische Details XR2A-2411-N Omron Electronics
Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote XR2A-2411-N nach Preis ab 5.26 EUR bis 8.4 EUR
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XR2A-2411-N | Hersteller : Omron Electronics Inc-EMC Div |
 Description: CONN IC DIP SOCKET 24POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper |
auf Bestellung 98 Stücke: Lieferzeit 10-14 Tag (e) |
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XR2A2411N | Hersteller : Omron |
Conn DIP Socket SKT 24 POS 2.54mm Solder ST Thru-Hole |
Produkt ist nicht verfügbar |