XR2A-2411-N Omron Electronics
| Anzahl | Preis |
|---|---|
| 1+ | 6.76 EUR |
| 10+ | 5.49 EUR |
| 20+ | 5.23 EUR |
| 260+ | 4.7 EUR |
| 500+ | 4.59 EUR |
| 1000+ | 4.17 EUR |
| 2500+ | 3.96 EUR |
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Produktbewertung abgeben
Technische Details XR2A-2411-N Omron Electronics
Description: CONN IC DIP SOCKET 24POS GOLD, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote XR2A-2411-N nach Preis ab 5.26 EUR bis 8.4 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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XR2A-2411-N | Omron Electronics Inc-EMC Div |
 Description: CONN IC DIP SOCKET 24POS GOLDContact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
auf Bestellung 98 Stücke: Lieferzeit 10-14 Tag (e) |
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| XR2A-2411-N |
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Hersteller: Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
auf Bestellung 98 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 8.4 EUR |
| 20+ | 5.94 EUR |
| 40+ | 5.5 EUR |
| 60+ | 5.26 EUR |