XR2C-0311-N Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 3POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SIP 3POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 3853 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
18+ | 1.46 EUR |
21+ | 1.27 EUR |
25+ | 1.16 EUR |
50+ | 1.09 EUR |
100+ | 1.05 EUR |
250+ | 0.96 EUR |
500+ | 0.91 EUR |
1000+ | 0.75 EUR |
3000+ | 0.68 EUR |
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Technische Details XR2C-0311-N Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 3POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 3 (1 x 3), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2C-0311-N
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
XR2C-0311-N | Hersteller : OMRON ELECTRONIC COMPONENTS |
Description: OMRON ELECTRONIC COMPONENTS - XR2C-0311-N - SIP SOCKET, GOLD, 3POS, 2.54MM, TH tariffCode: 85366930 productTraceability: Yes-Date/Lot Code Kontaktüberzug: Gold Plated Contacts Steckverbindertyp: SIP Socket rohsCompliant: YES Rastermaß: 0 Anzahl der Kontakte: 0 euEccn: NLR Kontaktmaterial: Beryllium Copper hazardous: false Reihenabstand: 0 rohsPhthalatesCompliant: YES directShipCharge: 25 usEccn: EAR99 Produktpalette: XR2 Series SVHC: To Be Advised |
auf Bestellung 871 Stücke: Lieferzeit 14-21 Tag (e) |
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XR2C-0311-N | Hersteller : Omron Electronics | IC & Component Sockets IC Socket |
auf Bestellung 1000 Stücke: Lieferzeit 14-28 Tag (e) |