XR2C-1011-N Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
| Anzahl | Preis |
|---|---|
| 7+ | 2.87 EUR |
| 10+ | 2.46 EUR |
| 25+ | 2.29 EUR |
| 50+ | 2.18 EUR |
| 100+ | 2.08 EUR |
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Technische Details XR2C-1011-N Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 10 (1 x 10), Operating Temperature: -55°C ~ 125°C, Type: SIP, Mounting Type: Threaded, Packaging: Bulk.
Weitere Produktangebote XR2C-1011-N nach Preis ab 1.95 EUR bis 3.77 EUR
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XR2C1011N | Omron Electronics Inc-EMC Div |
Description: CONN SOCKET SIP 10POS GOLD Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (1 x 10) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Threaded Packaging: Bulk |
auf Bestellung 408 Stücke: Lieferzeit 10-14 Tag (e) |
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XR2C-1011-N | Omron Electronics |
IC & Component Sockets Connector |
auf Bestellung 400 Stücke: Lieferzeit 182-186 Tag (e) |
|
| XR2C1011N |
|
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Threaded
Packaging: Bulk
Description: CONN SOCKET SIP 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Threaded
Packaging: Bulk
auf Bestellung 408 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 3.73 EUR |
| 10+ | 3.25 EUR |
| 400+ | 2.63 EUR |
| XR2C-1011-N |
|
Hersteller: Omron Electronics
IC & Component Sockets Connector
IC & Component Sockets Connector
auf Bestellung 400 Stücke:
Lieferzeit 182-186 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.77 EUR |
| 10+ | 3.08 EUR |
| 100+ | 2.94 EUR |
| 250+ | 2.66 EUR |
| 400+ | 2.43 EUR |
| 1200+ | 2.08 EUR |
| 2800+ | 1.95 EUR |