XR2C-1011-N Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
| Anzahl | Privatkunde |
|---|---|
| 7+ | 3.42 EUR |
| 10+ | 2.93 EUR |
| 25+ | 2.73 EUR |
| 50+ | 2.59 EUR |
| 100+ | 2.48 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
7 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details XR2C-1011-N Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD, Packaging: Bulk, Mounting Type: Threaded, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (1 x 10), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote XR2C-1011-N nach Preis ab 2.07 EUR bis 4.44 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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XR2C-1011-N | Omron Electronics |
IC & Component Sockets Connector |
auf Bestellung 400 Stücke: Lieferzeit 182-186 Tag (e) |
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XR2C-1011-N | Aratas |
IC & Component Sockets Connector |
auf Bestellung 389 Stücke: Lieferzeit 10-14 Tag (e) |
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XR2C1011N | Omron Electronics Inc-EMC Div |
Description: CONN SOCKET SIP 10POS GOLD Packaging: Bulk Mounting Type: Threaded Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 408 Stücke: Lieferzeit 10-14 Tag (e) |
|
| XR2C-1011-N |
|
Hersteller: Omron Electronics
IC & Component Sockets Connector
IC & Component Sockets Connector
auf Bestellung 400 Stücke:
Lieferzeit 182-186 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.99 EUR |
| 10+ | 3.26 EUR |
| 100+ | 3.12 EUR |
| 250+ | 2.82 EUR |
| 400+ | 2.57 EUR |
| 1200+ | 2.2 EUR |
| 2800+ | 2.07 EUR |
| XR2C-1011-N |
|
Hersteller: Aratas
IC & Component Sockets Connector
IC & Component Sockets Connector
auf Bestellung 389 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.06 EUR |
| 10+ | 3.56 EUR |
| 25+ | 3.09 EUR |
| 100+ | 2.82 EUR |
| 250+ | 2.57 EUR |
| 400+ | 2.27 EUR |
| 1200+ | 2.21 EUR |
| XR2C1011N |
|
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 408 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.44 EUR |
| 10+ | 3.87 EUR |
| 400+ | 3.13 EUR |