XR2C-2005 Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC DivDescription: CONN SOCKET SIP 20POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.26 EUR |
| 10+ | 12.05 EUR |
| 25+ | 11.41 EUR |
| 50+ | 11.15 EUR |
| 100+ | 10.61 EUR |
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Technische Details XR2C-2005 Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 20POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2C-2005
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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XR2C-2005 | Hersteller : Omron Electronics |
IC & Component Sockets CONNECTOR |
auf Bestellung 90 Stücke: Lieferzeit 14-28 Tag (e) |