XR2C-2005 Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 20POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (1 x 20)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
| Anzahl | Preis |
|---|---|
| 3+ | 8.31 EUR |
| 10+ | 7.87 EUR |
| 25+ | 6.41 EUR |
| 50+ | 6.2 EUR |
| 100+ | 6.19 EUR |
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Technische Details XR2C-2005 Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 20POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (1 x 20), Operating Temperature: -55°C ~ 125°C, Type: SIP, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote XR2C-2005
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
XR2C-2005 | Omron Electronics |
IC & Component Sockets CONNECTOR |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| XR2C-2005 |
|
Hersteller: Omron Electronics
IC & Component Sockets CONNECTOR
IC & Component Sockets CONNECTOR
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)