XR2C-2011-N Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC DivDescription: CONN SOCKET SIP 20POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 230 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 4.91 EUR |
| 10+ | 4.47 EUR |
| 25+ | 4.33 EUR |
| 50+ | 4.18 EUR |
| 100+ | 3.93 EUR |
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Technische Details XR2C-2011-N Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 20POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2C-2011-N nach Preis ab 3.19 EUR bis 5.72 EUR
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XR2C-2011-N | Hersteller : Omron Electronics |
IC & Component Sockets CONNECTORS |
auf Bestellung 465 Stücke: Lieferzeit 10-14 Tag (e) |
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