XR2C-2015 Omron Electronics Inc-EMC Div

Description: CONN SOCKET SIP 20POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (1 x 20), Operating Temperature: -55°C ~ 125°C, Type: SIP, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.