XR2C-3200-HSG Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC DivDescription: CONN IC SOCKET 32POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: Housing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 32)
Termination: Wire Wrap
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Beryllium Copper
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Technische Details XR2C-3200-HSG Omron Electronics Inc-EMC Div
Description: CONN IC SOCKET 32POS, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: Housing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (1 x 32), Termination: Wire Wrap, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote XR2C-3200-HSG
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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XR2C-3200-HSG | Hersteller : Omron Electronics |
IC & Component Sockets CONNECTOR |
Produkt ist nicht verfügbar |