XR2C-3200-HSG Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN IC SOCKET 32POS
Contact Material - Post: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 32 (1 x 32)
Operating Temperature: -55°C ~ 125°C
Type: Housing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Technische Details XR2C-3200-HSG Omron Electronics Inc-EMC Div
Description: CONN IC SOCKET 32POS, Contact Material - Post: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 32 (1 x 32), Operating Temperature: -55°C ~ 125°C, Type: Housing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote XR2C-3200-HSG
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
 |
XR2C-3200-HSG | Omron Electronics |
IC & Component Sockets CONNECTOR |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4 Stücke Im Einkaufswagen Stück im Wert von UAH |
| XR2C-3200-HSG |
|
Hersteller: Omron Electronics
IC & Component Sockets CONNECTOR
IC & Component Sockets CONNECTOR
Produkt ist nicht verfügbar
Mindestbestellmenge: 4 Stücke
Im Einkaufswagen
Stück im Wert von UAH