auf Bestellung 876 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 5.02 EUR |
| 10+ | 4.56 EUR |
| 20+ | 4.33 EUR |
| 50+ | 4.22 EUR |
| 100+ | 3.54 EUR |
| 200+ | 3.29 EUR |
| 500+ | 3.15 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details XR2C-2011-N Omron Electronics
Description: CONN SOCKET SIP 20POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (1 x 20), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote XR2C-2011-N nach Preis ab 4.02 EUR bis 5.03 EUR
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XR2C-2011-N | Hersteller : Omron Electronics Inc-EMC Div |
 Description: CONN SOCKET SIP 20POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 339 Stücke: Lieferzeit 10-14 Tag (e) |
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