XR2P-1041 Omron Electronics Inc-EMC Div
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.72 EUR |
| 10+ | 6.57 EUR |
| 25+ | 6.15 EUR |
| 50+ | 5.85 EUR |
| 100+ | 5.58 EUR |
| 400+ | 5.06 EUR |
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Technische Details XR2P-1041 Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD, Packaging: Bulk, Mounting Type: Threaded, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (1 x 10), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote XR2P-1041 nach Preis ab 5.82 EUR bis 8.32 EUR
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XR2P1041 | Omron Electronics Inc-EMC Div |
Description: CONN SOCKET SIP 10POS GOLD Packaging: Bulk Mounting Type: Threaded Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
auf Bestellung 795 Stücke: Lieferzeit 10-14 Tag (e) |
|
| XR2P1041 |
|
Hersteller: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
auf Bestellung 795 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.32 EUR |
| 10+ | 7.54 EUR |
| 400+ | 5.82 EUR |