Hersteller: Hitano
Widerstande THT > Widerstande THT - 3W 4W
Resistenz: 10 kOhm
Präzision und TKW (Temperaturkoeffizient des Widerstandes): ±5%, ±300ppm
P Nenn.,W: 3W
U Betriebs.,V: 500V
Abmessungen: 15x5mm, DAusfuhr.=0,76mm
Typ: Metalloxid miniatur
-55...+200°C

Hersteller: Mill-Max
IC & Component Sockets 18 PIN CARRIER

Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active

Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active

Hersteller: TE Connectivity
Category: Dedicated Crimping Tools
Description: Anvil
Type of spare part: anvil

Hersteller: ECS Inc.
Description: CRYSTAL 33.3330MHZ 18PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Load Capacitance: 18pF
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±30ppm
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Supplier Device Package: 4-SMD (3.2x2.5)
Height - Seated (Max): 0.031" (0.80mm)
ESR (Equivalent Series Resistance): 40 Ohms
Frequency: 33.333 MHz

Hersteller: ECS Inc.
Description: CRYSTAL 33.3330MHZ 18PF SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Load Capacitance: 18pF
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Type: MHz Crystal
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±30ppm
Frequency Tolerance: ±20ppm
Operating Mode: Fundamental
Supplier Device Package: 4-SMD (3.2x2.5)
Height - Seated (Max): 0.031" (0.80mm)
ESR (Equivalent Series Resistance): 40 Ohms
Frequency: 33.333 MHz

Hersteller: ECS
Crystals 33.333MHz 20ppm 18pF -40C +85C

Hersteller: RST ROZTOCZE
M22PW-18/180-07BK Latches

Hersteller: MaxLinear, Inc.
Description: EVAL BOARD FOR XR33183
Packaging: Bulk
Function: Transceiver, RS-422, RS-485
Type: Interface
Contents: Board(s)
Utilized IC / Part: XR33183
Supplied Contents: Board(s)

Hersteller: MaxLinear
RS-422/RS-485 Interface IC 3V-5.5V Receiver ESD Protection

Hersteller: MaxLinear, Inc.
Description: IC TRANSCEIVER 0/1 TSOT236
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Type: Receiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Number of Drivers/Receivers: 0/1
Data Rate: 52Mbps
Protocol: RS422, RS485
Supplier Device Package: TSOT-23-6
Receiver Hysteresis: 25 mV

Hersteller: PHILIPS

Hersteller: Mill-Max
IC & Component Sockets 18P TIN PIN GLD CONT

Hersteller: 3M
Description: TAPE BARRICADE RED/BLK 3"X333YDS
Packaging: Bulk
Color: Red, Black Print
Length: 1000' (304.8m) 333 yds
Thickness: 0.0020" (2.0 mils, 0.051mm)
Tape Type: Barricade - Printed
Width: 3.00" (76.20mm)
Usage: Warning - Caution, Danger
Adhesive: None

Hersteller: TE Connectivity AMP Connectors
Description: CONN HEADER R/A 16POS 2.54MM
Packaging: Tray
Features: Keying Slot
Connector Type: Header
Current Rating (Amps): 1A per Contact
Mounting Type: Through Hole, Right Angle
Number of Positions: 16
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -65°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold-Palladium
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.135" (3.43mm)
Insulation Height: 0.360" (9.14mm)
Shrouding: Shrouded - 4 Wall
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.240" (6.10mm)

Hersteller: Eaton - Electronics Division
Description: FUSE CERM 20A 250VAC 125VDC 3AB
Packaging: Bulk
Package / Case: 3AB, 3AG, 1/4" x 1-1/4"
Size / Dimension: 0.250" Dia x 1.250" L (6.35mm x 31.75mm)
Fuse Type: Cartridge, Ceramic
Mounting Type: Requires Holder
Response Time: Fast Blow
Approval Agency: CSA, UR
Breaking Capacity @ Rated Voltage: 200A AC, 10kA DC
Current Rating (Amps): 20 A
Voltage Rating - AC: 250 V
Voltage Rating - DC: 125 V

Hersteller: Texas Instruments
Description: IC TXRX NON-INVERT 5.5V 48-SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-SSOP

Hersteller: TDK Corporation
Description: CAP CER 15UF 25V X7R RADIAL
Packaging: Cut Tape (CT)
Tolerance: ±20%
Lead Style: Formed Leads - Kinked
Voltage - Rated: 25V
Package / Case: Radial
Temperature Coefficient: X7R
Size / Dimension: 0.295" L x 0.177" W (7.50mm x 4.50mm)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Lead Spacing: 0.197" (5.00mm)
Height - Seated (Max): 0.335" (8.50mm)
Part Status: Active
Capacitance: 15 µF

Hersteller: AMBERSIL
Description: AMBERSIL - INVERTIBLE AIR DUSTER /2, 200ML - Druckluftspray, Sprühdose, 200ml
tariffCode: 29035100
productTraceability: No
Behältertyp: Spray
rohsCompliant: YES
Gewicht: -
euEccn: NLR
Volumen: 200ml
hazardous: true
hazardCode: 1950
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: Invertible Air Duster /2
SVHC: No SVHC (07-Nov-2024)

Hersteller: Pulse Electronics
Description: FIXED IND 24.5UH 11A 15 MOHM SMD
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.854" L x 0.846" W (21.70mm x 21.50mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -40°C ~ 130°C
DC Resistance (DCR): 15mOhm Max
Current - Saturation (Isat): 14.5A
Inductance Frequency - Test: 100 kHz
Height - Seated (Max): 0.492" (12.50mm)
Inductance: 24.5 µH
Current Rating (Amps): 11 A

Hersteller: Pulse Electronics
Description: FIXED IND 24.5UH 11A 15 MOHM SMD
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: Nonstandard
Size / Dimension: 0.854" L x 0.846" W (21.70mm x 21.50mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -40°C ~ 130°C
DC Resistance (DCR): 15mOhm Max
Current - Saturation (Isat): 14.5A
Inductance Frequency - Test: 100 kHz
Height - Seated (Max): 0.492" (12.50mm)
Inductance: 24.5 µH
Current Rating (Amps): 11 A

Hersteller: Nichicon
Description: CAP ALUM 68UF 20% 400V RADIAL TH
Packaging: Cut Tape (CT)
Tolerance: ±20%
Package / Case: Radial, Can
Size / Dimension: 0.630" Dia (16.00mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.295" (7.50mm)
Lifetime @ Temp.: 12000 Hrs @ 105°C
Height - Seated (Max): 1.043" (26.50mm)
Part Status: Active
Capacitance: 68 µF
Voltage - Rated: 400 V
Ripple Current @ Low Frequency: 640 mA @ 120 Hz
Ripple Current @ High Frequency: 1.28 A @ 100 kHz

Hersteller: Taiyo Yuden
Description: CAP CER 0.1UF 50V X5R 0603
Packaging: Tape & Reel (TR)
Tolerance: ±10%
Voltage - Rated: 50V
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: X5R
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 85°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.035" (0.90mm)
Part Status: Active
Capacitance: 0.1 µF

Hersteller: Taiyo Yuden
Description: CAP CER 0.1UF 50V X5R 0603
Tolerance: ±10%
Packaging: Cut Tape (CT)
Voltage - Rated: 50V
Package / Case: 0603 (1608 Metric)
Temperature Coefficient: X5R
Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 85°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.035" (0.90mm)
Part Status: Active
Capacitance: 0.1 µF

Hersteller: Aptiv (formerly Delphi)
Automotive Connectors ASM CONN 2 F HYBRID 2.8 ORN

Hersteller: APTIV
ASM CONN 3 F HYBRID 2.8 ORN

Hersteller: APTIV
ASM CONN 3 F HYBRID 2.8 ORN

Hersteller: Molex
Description: CONN RCPT 12POS IN-LINE SLDR
Features: Cable Clamp
Packaging: Bulk
Connector Type: Receptacle, Female Blade Sockets
Color: Black
Mounting Type: Free Hanging (In-Line)
Termination: Solder Eyelet(s)
Number of Rows: 3
Number of Positions: 12

Hersteller: TE Connectivity
Crimpers / Crimping Tools ANVIL, COMBINATION

Hersteller: Amphenol Industrial Operations
Description: CLAMP
Packaging: Bulk

Hersteller: Amphenol Industrial
Circular MIL Spec Tools, Hardware & Accessories E BACKSHELL PT07 SZ 18 OLV DRB

Hersteller: Phoenix Contact
Fixed Terminal Blocks MKDS 3/ 2-5,08 GY35 BD:+,+

Hersteller: TE Connectivity AMP Connectors
Description: MJ HS V * 8 8 * * * * * 30 * J 3
Packaging: Bulk
Connector Type: Jack
Contact Finish: Tin
Mounting Type: Through Hole
Shielding: Shielded, EMI Finger
Orientation: Vertical
Number of Positions/Contacts: 8p8c (RJ45, Ethernet)
Termination: Solder
LED Color: Does Not Contain LED
Tab Direction: User Selectable
Contact Material: Phosphor Bronze
Number of Ports: 1
Number of Rows: 1

Hersteller: TE Connectivity / ERNI
Modular Connectors / Ethernet Connectors MJ HS V * 8 8 * * * * * 30 * J 3 133819

Hersteller: Weidmüller
Description: LMF 5.00/14/90 3.5SN OR BX
Features: Interlocking (Side)
Packaging: Bulk
Color: Orange
Mounting Type: Through Hole
Wire Gauge: 12-24 AWG
Pitch: 0.197" (5.00mm)
Mating Orientation: Horizontal with Board
Positions Per Level: 14
Wire Termination: Screwless - Leg Spring, Push-In Spring
Part Status: Active
Current: 20 A
Number of Levels: 1
Voltage: 300 V

Hersteller: Weidmuller
Barrier Terminal Blocks LMF 5.00/14/90 3.5SN OR BX

Hersteller: ITT Cannon
Circular MIL Spec Connector

Hersteller: TE Connectivity / AMP
Crimpers / Crimping Tools ANVIL, COMBINATION

Hersteller: TE Connectivity
Crimpers / Crimping Tools ANVIL, COMBINATION

Hersteller: Laird Technologies
EMI Gaskets, Sheets, Absorbers & Shielding MF-190 1.5X12X12 ECCOSORB

Hersteller: TE Connectivity
TERMINAL,COPALUM R 1/0 5/16

Hersteller: TE Connectivity
TERMINAL,COPALUM R 1/0 3/8

Hersteller: TE Connectivity
Bench Top Tools ANVIL, COMBINATION

Hersteller: TE Connectivity
Bench Top Tools ANVIL, COMBINATION

Hersteller: TE Connectivity
Bench Top Tools ANVIL, COMBINATION

Hersteller: Molex
Headers & Wire Housings 1.25WB DL ST 18CKT BK G038 W/ KAP

Hersteller: Molex
Description: 1.25WB DL ST ASSY 18CKT BK G038
Packaging: Tape & Reel (TR)

Hersteller: TE Connectivity Raychem Cable Protection
Description: 55PC0233-18-3/6/9CS2958
Packaging: Bulk

Hersteller: TE Connectivity Aerospace, Defense and Marine
Description: 55PC1133-18-3/6/9-9CS3331
Packaging: Bulk

Hersteller: TE Connectivity
Bench Top Tools ANVIL, COMBINATION

Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy

Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy

Hersteller: Mill-Max
IC & Component Sockets 18P DIP CARRIER SKT .146L LOW PROFILE

Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy

Hersteller: Mill-Max
IC & Component Sockets 18P DIP CARRIER SKT .170L ULT LO PROFILE

Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass

Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy

Hersteller: Mill-Max
IC & Component Sockets 18P DIP CARRIER SKT .136L ULT LO PROFILE

Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET CARRIER LOWPRO .300 18POS
Features: Carrier, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy

Hersteller: Mill-Max
IC & Component Sockets 18 PIN CARRIER