Suchergebnisse für "53692" : 131
Art der Ansicht :
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
RC2012F3162CS | Samsung Electro-Mechanics |
Description: RES SMD 31.6K OHM 1% 1/8W 0805 Packaging: Cut Tape (CT) Power (Watts): 0.125W, 1/8W Tolerance: ±1% Features: Moisture Resistant Package / Case: 0805 (2012 Metric) Temperature Coefficient: ±100ppm/°C Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Composition: Thick Film Operating Temperature: -55°C ~ 155°C Number of Terminations: 2 Supplier Device Package: 0805 Height - Seated (Max): 0.026" (0.65mm) Part Status: Active Resistance: 31.6 kOhms |
Produkt ist nicht verfügbar |
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SP5748GGK0AVMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5748GGK0AVMJ6R | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM |
Produkt ist nicht verfügbar |
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SPC5744PK1AMLQ9 | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 2.5MB (2.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5744PK1AMLQ9 | NXP Semiconductors | 32-bit Microcontrollers - MCU 2.5MB, 384K RAM, 144pin, 200MHz |
Produkt ist nicht verfügbar |
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SPC5748GGK0AVMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5748GGK0AVMJ6 | NXP Semiconductors | 32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM |
Produkt ist nicht verfügbar |
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UKL1E470KEDANATD | Nichicon |
Description: CAP ALUM 47UF 10% 25V RADIAL Packaging: Tape & Box (TB) Tolerance: ±10% Package / Case: Radial, Can Size / Dimension: 0.248" Dia (6.30mm) Polarization: Polar Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Applications: General Purpose Lead Spacing: 0.098" (2.50mm) Lifetime @ Temp.: 1000 Hrs @ 105°C Height - Seated (Max): 0.472" (12.00mm) Part Status: Not For New Designs Capacitance: 47 µF Voltage - Rated: 25 V Ripple Current @ Low Frequency: 170 mA @ 120 Hz Ripple Current @ High Frequency: 340 mA @ 10 kHz |
Produkt ist nicht verfügbar |
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UMK063CG8R3DTHF | Taiyo Yuden |
Description: CAP CER 8.3PF 50V C0G/NP0 0201 Packaging: Tape & Reel (TR) Tolerance: ±0.5pF Voltage - Rated: 50V Package / Case: 0201 (0603 Metric) Temperature Coefficient: C0G, NP0 Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.013" (0.33mm) Capacitance: 8.3 pF |
Produkt ist nicht verfügbar |
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UMK063CG8R3DTHF | Taiyo Yuden |
Description: CAP CER 8.3PF 50V C0G/NP0 0201 Packaging: Cut Tape (CT) Tolerance: ±0.5pF Voltage - Rated: 50V Package / Case: 0201 (0603 Metric) Temperature Coefficient: C0G, NP0 Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm) Mounting Type: Surface Mount, MLCC Operating Temperature: -55°C ~ 125°C Applications: Automotive Ratings: AEC-Q200 Thickness (Max): 0.013" (0.33mm) Capacitance: 8.3 pF |
Produkt ist nicht verfügbar |
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VLS3012T-470MR34 | TDK Corporation |
Description: FIXED IND 47UH 340MA 1.512OHM SM Tolerance: ±20% Packaging: Tape & Reel (TR) Package / Case: Nonstandard Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Mounting Type: Surface Mount Shielding: Shielded Type: Wirewound Operating Temperature: -40°C ~ 105°C DC Resistance (DCR): 1.512Ohm Max Current - Saturation (Isat): 340mA Inductance Frequency - Test: 1 MHz Height - Seated (Max): 0.047" (1.20mm) Inductance: 47 µH Current Rating (Amps): 340 mA |
Produkt ist nicht verfügbar |
RC2012F3162CS |
Hersteller: Samsung Electro-Mechanics
Description: RES SMD 31.6K OHM 1% 1/8W 0805
Packaging: Cut Tape (CT)
Power (Watts): 0.125W, 1/8W
Tolerance: ±1%
Features: Moisture Resistant
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0805
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 31.6 kOhms
Description: RES SMD 31.6K OHM 1% 1/8W 0805
Packaging: Cut Tape (CT)
Power (Watts): 0.125W, 1/8W
Tolerance: ±1%
Features: Moisture Resistant
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0805
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 31.6 kOhms
Produkt ist nicht verfügbar
SP5748GGK0AVMJ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5748GGK0AVMJ6R |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
Produkt ist nicht verfügbar
SPC5744PK1AMLQ9 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5744PK1AMLQ9 |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 2.5MB, 384K RAM, 144pin, 200MHz
32-bit Microcontrollers - MCU 2.5MB, 384K RAM, 144pin, 200MHz
Produkt ist nicht verfügbar
SPC5748GGK0AVMJ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5748GGK0AVMJ6 |
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
Produkt ist nicht verfügbar
UKL1E470KEDANATD |
Hersteller: Nichicon
Description: CAP ALUM 47UF 10% 25V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±10%
Package / Case: Radial, Can
Size / Dimension: 0.248" Dia (6.30mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.098" (2.50mm)
Lifetime @ Temp.: 1000 Hrs @ 105°C
Height - Seated (Max): 0.472" (12.00mm)
Part Status: Not For New Designs
Capacitance: 47 µF
Voltage - Rated: 25 V
Ripple Current @ Low Frequency: 170 mA @ 120 Hz
Ripple Current @ High Frequency: 340 mA @ 10 kHz
Description: CAP ALUM 47UF 10% 25V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±10%
Package / Case: Radial, Can
Size / Dimension: 0.248" Dia (6.30mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.098" (2.50mm)
Lifetime @ Temp.: 1000 Hrs @ 105°C
Height - Seated (Max): 0.472" (12.00mm)
Part Status: Not For New Designs
Capacitance: 47 µF
Voltage - Rated: 25 V
Ripple Current @ Low Frequency: 170 mA @ 120 Hz
Ripple Current @ High Frequency: 340 mA @ 10 kHz
Produkt ist nicht verfügbar
UMK063CG8R3DTHF |
Hersteller: Taiyo Yuden
Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Tape & Reel (TR)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Tape & Reel (TR)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Produkt ist nicht verfügbar
UMK063CG8R3DTHF |
Hersteller: Taiyo Yuden
Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Cut Tape (CT)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Cut Tape (CT)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Produkt ist nicht verfügbar
VLS3012T-470MR34 |
Hersteller: TDK Corporation
Description: FIXED IND 47UH 340MA 1.512OHM SM
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 1.512Ohm Max
Current - Saturation (Isat): 340mA
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Inductance: 47 µH
Current Rating (Amps): 340 mA
Description: FIXED IND 47UH 340MA 1.512OHM SM
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 1.512Ohm Max
Current - Saturation (Isat): 340mA
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Inductance: 47 µH
Current Rating (Amps): 340 mA
Produkt ist nicht verfügbar