Suchergebnisse für "53692" : 131

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RC2012F3162CS RC2012F3162CS Samsung Electro-Mechanics RC_Series_ds.pdf Description: RES SMD 31.6K OHM 1% 1/8W 0805
Packaging: Cut Tape (CT)
Power (Watts): 0.125W, 1/8W
Tolerance: ±1%
Features: Moisture Resistant
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0805
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 31.6 kOhms
Produkt ist nicht verfügbar
SP5748GGK0AVMJ6R SP5748GGK0AVMJ6R NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5748GGK0AVMJ6R SP5748GGK0AVMJ6R NXP Semiconductors phgl_s_a0004670910_1-2279763.pdf 32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
Produkt ist nicht verfügbar
SPC5744PK1AMLQ9 SPC5744PK1AMLQ9 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5744PK1AMLQ9 SPC5744PK1AMLQ9 NXP Semiconductors MPC5744P-1360009.pdf 32-bit Microcontrollers - MCU 2.5MB, 384K RAM, 144pin, 200MHz
Produkt ist nicht verfügbar
SPC5748GGK0AVMJ6 SPC5748GGK0AVMJ6 NXP USA Inc. Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5748GGK0AVMJ6 SPC5748GGK0AVMJ6 NXP Semiconductors MPC5748G-1391760.pdf 32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
Produkt ist nicht verfügbar
UKL1E470KEDANATD UKL1E470KEDANATD Nichicon e-ukl.pdf Description: CAP ALUM 47UF 10% 25V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±10%
Package / Case: Radial, Can
Size / Dimension: 0.248" Dia (6.30mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.098" (2.50mm)
Lifetime @ Temp.: 1000 Hrs @ 105°C
Height - Seated (Max): 0.472" (12.00mm)
Part Status: Not For New Designs
Capacitance: 47 µF
Voltage - Rated: 25 V
Ripple Current @ Low Frequency: 170 mA @ 120 Hz
Ripple Current @ High Frequency: 340 mA @ 10 kHz
Produkt ist nicht verfügbar
UMK063CG8R3DTHF UMK063CG8R3DTHF Taiyo Yuden UMK063CG8R3DTHF_SS.pdf Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Tape & Reel (TR)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Produkt ist nicht verfügbar
UMK063CG8R3DTHF UMK063CG8R3DTHF Taiyo Yuden UMK063CG8R3DTHF_SS.pdf Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Cut Tape (CT)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Produkt ist nicht verfügbar
VLS3012T-470MR34 VLS3012T-470MR34 TDK Corporation VLS3012.pdf Description: FIXED IND 47UH 340MA 1.512OHM SM
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 1.512Ohm Max
Current - Saturation (Isat): 340mA
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Inductance: 47 µH
Current Rating (Amps): 340 mA
Produkt ist nicht verfügbar
RC2012F3162CS RC_Series_ds.pdf
RC2012F3162CS
Hersteller: Samsung Electro-Mechanics
Description: RES SMD 31.6K OHM 1% 1/8W 0805
Packaging: Cut Tape (CT)
Power (Watts): 0.125W, 1/8W
Tolerance: ±1%
Features: Moisture Resistant
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Composition: Thick Film
Operating Temperature: -55°C ~ 155°C
Number of Terminations: 2
Supplier Device Package: 0805
Height - Seated (Max): 0.026" (0.65mm)
Part Status: Active
Resistance: 31.6 kOhms
Produkt ist nicht verfügbar
SP5748GGK0AVMJ6R
SP5748GGK0AVMJ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5748GGK0AVMJ6R phgl_s_a0004670910_1-2279763.pdf
SP5748GGK0AVMJ6R
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
Produkt ist nicht verfügbar
SPC5744PK1AMLQ9
SPC5744PK1AMLQ9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5744PK1AMLQ9 MPC5744P-1360009.pdf
SPC5744PK1AMLQ9
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 2.5MB, 384K RAM, 144pin, 200MHz
Produkt ist nicht verfügbar
SPC5748GGK0AVMJ6
SPC5748GGK0AVMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5748GGK0AVMJ6 MPC5748G-1391760.pdf
SPC5748GGK0AVMJ6
Hersteller: NXP Semiconductors
32-bit Microcontrollers - MCU 32 BIT, 6MB FLASH, 768 RAM
Produkt ist nicht verfügbar
UKL1E470KEDANATD e-ukl.pdf
UKL1E470KEDANATD
Hersteller: Nichicon
Description: CAP ALUM 47UF 10% 25V RADIAL
Packaging: Tape & Box (TB)
Tolerance: ±10%
Package / Case: Radial, Can
Size / Dimension: 0.248" Dia (6.30mm)
Polarization: Polar
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.098" (2.50mm)
Lifetime @ Temp.: 1000 Hrs @ 105°C
Height - Seated (Max): 0.472" (12.00mm)
Part Status: Not For New Designs
Capacitance: 47 µF
Voltage - Rated: 25 V
Ripple Current @ Low Frequency: 170 mA @ 120 Hz
Ripple Current @ High Frequency: 340 mA @ 10 kHz
Produkt ist nicht verfügbar
UMK063CG8R3DTHF UMK063CG8R3DTHF_SS.pdf
UMK063CG8R3DTHF
Hersteller: Taiyo Yuden
Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Tape & Reel (TR)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Produkt ist nicht verfügbar
UMK063CG8R3DTHF UMK063CG8R3DTHF_SS.pdf
UMK063CG8R3DTHF
Hersteller: Taiyo Yuden
Description: CAP CER 8.3PF 50V C0G/NP0 0201
Packaging: Cut Tape (CT)
Tolerance: ±0.5pF
Voltage - Rated: 50V
Package / Case: 0201 (0603 Metric)
Temperature Coefficient: C0G, NP0
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 125°C
Applications: Automotive
Ratings: AEC-Q200
Thickness (Max): 0.013" (0.33mm)
Capacitance: 8.3 pF
Produkt ist nicht verfügbar
VLS3012T-470MR34 VLS3012.pdf
VLS3012T-470MR34
Hersteller: TDK Corporation
Description: FIXED IND 47UH 340MA 1.512OHM SM
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: Nonstandard
Size / Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Mounting Type: Surface Mount
Shielding: Shielded
Type: Wirewound
Operating Temperature: -40°C ~ 105°C
DC Resistance (DCR): 1.512Ohm Max
Current - Saturation (Isat): 340mA
Inductance Frequency - Test: 1 MHz
Height - Seated (Max): 0.047" (1.20mm)
Inductance: 47 µH
Current Rating (Amps): 340 mA
Produkt ist nicht verfügbar
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