Hersteller: 3M
Description: STANDARD ABRASIVES QUICK CHANGE
Packaging: Bulk

Hersteller: Texas Instruments
Description: IC BATT CHG LI-ION 1CELL 49DSBGA
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, DSBGA
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 49-DSBGA (2.8x2.8)
Charge Current - Max: 2.5A
Fault Protection: Over Temperature, Short Circuit
Voltage - Supply (Max): 10V
Battery Pack Voltage: 3.7V
Current - Charging: Constant - Programmable
Part Status: Active

Hersteller: Texas Instruments
Description: IC BATT CHG LI-ION 1CELL 49DSBGA
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, DSBGA
Number of Cells: 1
Mounting Type: Surface Mount
Interface: USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 49-DSBGA (2.8x2.8)
Charge Current - Max: 2.5A
Fault Protection: Over Temperature, Short Circuit
Voltage - Supply (Max): 10V
Battery Pack Voltage: 3.7V
Current - Charging: Constant - Programmable
Part Status: Active

Hersteller: Samsung Electro-Mechanics
Description: CAP CER 4.7UF 6.3V X6S 0805
Packaging: Cut Tape (CT)
Tolerance: ±10%
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X6S
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Thickness (Max): 0.053" (1.35mm)
Part Status: Active
Capacitance: 4.7 µF

Hersteller: Samsung Electro-Mechanics
Description: CAP CER 4.7UF 6.3V X6S 0805
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X6S
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Thickness (Max): 0.053" (1.35mm)
Part Status: Active
Capacitance: 4.7 µF

Hersteller: Nexperia USA Inc.
Description: GANB4R8-040CBA/SOT8086/WLCSP22
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20A (Ta)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): 40V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 15.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 887 pF @ 20 V
Package / Case: 22-UFBGA, WLCSP
Rds On (Max) @ Id, Vgs: 4.8mOhm @ 10A, 5V
Power Dissipation (Max): 13W (Ta)
Supplier Device Package: 22-WLCSP (2.1x2.1)

Hersteller: Nexperia USA Inc.
Description: GANB4R8-040CBA/SOT8086/WLCSP22
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20A (Ta)
Vgs(th) (Max) @ Id: 2.4V @ 1mA
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): 40V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 15.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 887 pF @ 20 V
Package / Case: 22-UFBGA, WLCSP
Rds On (Max) @ Id, Vgs: 4.8mOhm @ 10A, 5V
Power Dissipation (Max): 13W (Ta)
Supplier Device Package: 22-WLCSP (2.1x2.1)

Hersteller: Microchip Technology
Description: DIODE GEN PURP 440V 1.75A D-5B
Packaging: Bulk
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 40pF @ 10V, 1MHz
Current - Average Rectified (Io): 1.75A
Supplier Device Package: D-5B
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 440 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 2 A
Current - Reverse Leakage @ Vr: 2 µA @ 440 V
Grade: Military
Qualification: MIL-PRF-19500/590

Hersteller: Microchip Technology
Description: IC REG BCK 1.575V/1.8V DL 10TMLF
Packaging: Tape & Reel (TR)
Package / Case: 10-UFDFN, 10-TMLF®
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 2
Function: Step-Down
Current - Output: 400mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 4MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 10-TMLF® (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.575V, 1.8V
Part Status: Obsolete

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 37P SZ 14 PIN

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 37P SZ 14 SOCKET

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 37P Sz 14 Sckt Crimp Back Pnl Box Mt Rec

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 37P Sz 14 Box Mount Recpt Skt

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 15P Sz 14 Sckt Crimp Back Pnl Box Mt Rec

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 18P SZ 14 PIN

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector RECEPT

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 37P FM SZ 14 PIN

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector MS-JT-RE CRIMP, MIL-C-38999

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 37P 14 SIZE BOX MOUNT RECEPTACLE PIN

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector 5P SZ 14 PIN

Hersteller: Amphenol Aerospace
Circular MIL Spec Connector MS-JT-RE CRIMP, MIL-C-38999

Hersteller: Texas Instruments
Description: IC MCU 16BIT 8KB FRAM 40VQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FRAM
Core Processor: MSP430 CPUXV2
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-VQFN (6x6)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified

Hersteller: Phoenix Contact
1163034

Hersteller: Skyworks Solutions Inc.
Description: DGTL ISO 3750VRMS 1CH GP 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: General Purpose
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.5V ~ 5.5V
Data Rate: 15Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 3750Vrms
Inputs - Side 1/Side 2: 1/0
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 2.5ns, 2.5ns
Common Mode Transient Immunity (Min): 35kV/µs
Propagation Delay tpLH / tpHL (Max): 50ns, 50ns
Isolated Power: No
Channel Type: Unidirectional
Pulse Width Distortion (Max): 25ns
Part Status: Active
Number of Channels: 1

Hersteller: Texas Instruments
Description: IC GATE DRVR HALF-BRIDGE 8SOPWR
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 140°C (TJ)
Voltage - Supply: 8V ~ 17V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 120 V
Supplier Device Package: 8-SO PowerPad
Rise / Fall Time (Typ): 7.2ns, 5.5ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 2.4V, 5.9V
Current - Peak Output (Source, Sink): 4A, 4A
Part Status: Active
DigiKey Programmable: Not Verified