Produkte > TERASIC INC. > Alle Produkte des Herstellers TERASIC INC. (218) > Seite 4 nach 4

Hersteller: Terasic Inc.
Description: DE10-PRO GX 1650KLE DEVELOPMENT
Packaging: Box
For Use With/Related Products: 1SG165H
Type: FPGA
Contents: Board(s)
Platform: Stratix 10 GX FPGA DE10-Pro 8GBx4 PCIe Card
Part Status: Obsolete

Hersteller: Terasic Inc.
Description: OPENVINO STARTER KIT GX EDITION
Packaging: Box
For Use With/Related Products: Cyclone V
Type: FPGA
Contents: Board(s)
Platform: Cyclone V FPGA OpenVINO PCIe Card
Part Status: Obsolete

Hersteller: Terasic Inc.
Description: DE10-PRO GX 2800KLE DEVELOPMENT
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Stratix 10 GX FPGA DE10-Pro 4GBx4 PCIe Card
Part Status: Obsolete

Hersteller: Terasic Inc.
Description: DE10-PRO SX 2800KLE DEVELOPMENT
Packaging: Box
For Use With/Related Products: 1SX280H
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Stratix 10 SX SoC DE10-Pro 4GBx4 PCIe Card
Part Status: Obsolete
Utilized IC / Part: 1SX280H

Hersteller: Terasic Inc.
Description: TERASIC DE10-PRO GX 2800KLE DEVE
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Stratix 10 GX FPGA DE10-Pro 8GBx4 PCIe Card
Part Status: Obsolete

Hersteller: Terasic Inc.
Description: DE10-PRO SX 2800KLE DEVELOPMENT

Hersteller: Terasic Inc.
Description: APOLLO S10 SOM BOARD

Hersteller: Terasic Inc.
Description: T-CORE PLATFORM KIT
Packaging: Box
For Use With/Related Products: 10M50DA
Type: FPGA
Contents: Board(s), Cable(s)
Platform: MAX 10 FPGA T-Core
Part Status: Active
Utilized IC / Part: 10M50DA

Hersteller: Terasic Inc.
Description: TREX-S2 MOTHERBOARD TYPE A TMA

Hersteller: Terasic Inc.
Description: MAX 10 PLUS EVALBOARD
Packaging: Box
For Use With/Related Products: 10M50DA
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: 10M50DA
Platform: MAX 10 FPGA Plus
Part Status: Active

Hersteller: Terasic Inc.
Description: FLIK (FPGA CLIENT INNOVATION KIT

Hersteller: Terasic Inc.
Description: DEV KIT DE10-PRO-16G XS 4GBX4
Packaging: Box
For Use With/Related Products: 1SX280H
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: 1SX280H
Platform: Stratix 10 SX SoC DE10-Pro 4GBx4 PCIe Card
Part Status: Active

Hersteller: Terasic Inc.
Description: DE10-PRO SX 2800KLE DEVELOPMENT
Packaging: Box
For Use With/Related Products: 1SX280H
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Stratix 10 SX SoC DE10-Pro 8GBx4 PCIe Card
Part Status: Active
Utilized IC / Part: 1SX280H

Hersteller: Terasic Inc.
Description: DEVELOPER KIT FOR OPENVINO TOOLK
Packaging: Box
For Use With/Related Products: Cyclone V
Type: FPGA
Contents: Board(s)
Platform: Cyclone V FPGA OpenVINO PCIe Card
Part Status: Active

Hersteller: Terasic Inc.
Description: APOLLO DEVELOPER KIT
Packaging: Box
For Use With/Related Products: 1SX280H
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Stratix 10 SX SoC Apollo S10
Part Status: Active

Hersteller: Terasic Inc.
Description: DE10-NANO FPGA CLOUD CONN KIT
Packaging: Box
For Use With/Related Products: 5CSEBA6
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Cyclone V SE SoC DE10-Nano Cloud Connectivity WiFi BT
Part Status: Obsolete
Utilized IC / Part: 5CSEBA6

Hersteller: Terasic Inc.
Description: FOR DE1/CSK/DE2
Packaging: Bulk
For Use With/Related Products: DE1, DE2, DE2-70, Cyclone II Starter Kit
Accessory Type: Accessory Kit
Utilized IC / Part: DE1, DE2, DE2-70, Cyclone II Starter Kit

Hersteller: Terasic Inc.
Description: DE10-NANO FPGA CLOUD CONN KIT
Packaging: Box
For Use With/Related Products: 5CSEBA6
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: 5CSEBA6
Platform: Cyclone V SE SoC DE10-Nano Cloud Connectivity WiFi
Part Status: Discontinued at Digi-Key

Hersteller: Terasic Inc.
Description: DE10-AGILEX DEVELOPMENT BOARD, B
Packaging: Box
For Use With/Related Products: AGFB014
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: DE10-Agilex Agilex 7 F-Series SoC FPGA PCIe Card
Part Status: Active
Utilized IC / Part: AGFB014

Hersteller: Terasic Inc.
Description: RFS2 BOARD
Packaging: Bulk
Function: Bluetooth, WiFi
Type: RF
Contents: Board(s)
Utilized IC / Part: ESP32-WROOM-32E

Hersteller: Terasic Inc.
Description: PCIE X16 ENDPOINT FMC+ MODULE
Packaging: Box

Hersteller: Terasic Inc.
Description: MERCURY A2700 ACCELERATOR CARD
Packaging: Box

Hersteller: Terasic Inc.
Description: AGILEX 7 FPGA STARTER KIT
Packaging: Bulk
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: AGFB027
Platform: Agilex 7 F-Series SoC FPGA PCIe Card

Hersteller: Terasic Inc.
Description: PR-115 INTEL PATHFINDER RISC V

Hersteller: Terasic Inc.
Description: DE10-NANO FPGA CLOUD CONN 2.0
Packaging: Bulk
For Use With/Related Products: 5CSEBA6
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: 5CSEBA6
Platform: Cyclone V SE SoC DE10-Nano Cloud Connectivity WiFi BT
Part Status: Active

Hersteller: Terasic Inc.
Description: ATUM A5 AGILEX 5 E SOC FPGA BRD
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: A5ED065B
Platform: Atum A5 Agilex 5 E-Series SoC FPGA

Hersteller: Terasic Inc.
Description: SPIDER ROBOT KIT - DE10-NANO
Packaging: Box

Hersteller: Terasic Inc.
Description: DE10-AGILEX DEVELOPMENT BOARD, B
Packaging: Box
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Utilized IC / Part: AGFB014
Platform: DE10-Agilex Agilex 7 F-Series SoC FPGA PCIe Card

Hersteller: Terasic Inc.
Description: DEV KIT MAX 10 NEEK
Packaging: Box
For Use With/Related Products: 10M50DA
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: MAX 10 FPGA NEEK
Part Status: Active
Utilized IC / Part: 10M50DA

Hersteller: Terasic Inc.
Description: HSMC FLEX CABLE

Hersteller: Terasic Inc.
Description: THCB-HMF2 CONNECTOR CARD

Hersteller: Terasic Inc.
Description: HMF3C HEIGHT EXT ADAPTER FOR TR4
Packaging: Box
For Use With/Related Products: Board with HSMC Connector
Accessory Type: Extension Board

Hersteller: Terasic Inc.
Description: HMF3D HEIGHT EXT ADAPTER FOR TR4

Hersteller: Terasic Inc.
Description: DDR3-1866 8G DUAL RANK SODIMM
Packaging: Box
Memory Size: 8GB
Memory Type: DDR3 SDRAM
Transfer Rate (Mb/s, MT/s, MHz): 1866

Hersteller: Terasic Inc.
Description: VITA FMC LOOPBACK BOARD
Packaging: Bag
Function: FPGA Mezzanine Card (FMC)
Type: Interface
Contents: Board(s)

Hersteller: Terasic Inc.
Description: FMC+ LOOPBACK BOARD
Packaging: Bag
Function: FPGA Mezzanine Card (FMC)
Type: Interface
Contents: Board(s)

Hersteller: Terasic Inc.
Description: QDR-IV MEMORY MODULE STRATIX 10

Hersteller: Terasic Inc.
Description: VITA FMC LOOPBACK BOARD
Packaging: Bulk
Function: FPGA Mezzanine Card (FMC)
Type: Interface
Contents: Board(s)
Platform: Stratix