Produkte > ADVANCED THERMAL SOLUTIONS INC. > Alle Produkte des Herstellers ADVANCED THERMAL SOLUTIONS INC. (110410) > Seite 1835 nach 1841
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ATS-TEC30-36-017 | Advanced Thermal Solutions Inc. |
Description: TEC MODULE, 30X30X3.6Number of Stages: 1 Resistance: 3.42 Ohms Voltage - Max: 15.4 V Current - Max: 3 A Qmax @ Th: 26.7W @ 27°C Delta Tmax @ Th: 68°C @ 27°C Height: 3.60mm Type: TEC (Thermoelectric Cooler) Size / Dimension: Square - 30.00mm L x 30.00mm W Features: Lead Wires, Sealed - Silicone RTV Packaging: Bulk |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-TEC30-44-082 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3mmCurrent - Max: 9 A Qmax @ Th: 45.5W @ 27°C Delta Tmax @ Th: 66°C @ 27°C Height: 3.00mm Operating Temperature: 80°C Type: TEC (Thermoelectric Cooler) Size / Dimension: Square - 30.00mm L x 30.00mm W Features: Lead Wires Packaging: Box Number of Stages: 1 Resistance: 750 mOhms Voltage - Max: 8.61 V |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-TEC30-64-086 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3.2mmNumber of Stages: 1 Resistance: 520 mOhms Voltage - Max: 8.61 V Current - Max: 13 A Qmax @ Th: 65.7W @ 27°C Delta Tmax @ Th: 66°C @ 27°C Height: 3.20mm Operating Temperature: 80°C Type: TEC (Thermoelectric Cooler) Size / Dimension: Square - 30.00mm L x 30.00mm W Features: Lead Wires Packaging: Box |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-TEC30-74-084 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3.1mmNumber of Stages: 1 Resistance: 450 mOhms Voltage - Max: 8.61 V Current - Max: 15 A Qmax @ Th: 75.9W @ 27°C Delta Tmax @ Th: 66°C @ 27°C Height: 3.10mm Operating Temperature: 80°C Type: TEC (Thermoelectric Cooler) Size / Dimension: Square - 30.00mm L x 30.00mm W Features: Lead Wires Packaging: Box |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-TEC30-59-085 | Advanced Thermal Solutions Inc. |
Description: TEC Module 30x30x3.2mmPackaging: Box Features: Lead Wires Size / Dimension: Square - 30.00mm L x 30.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.20mm Delta Tmax @ Th: 66°C @ 27°C Qmax @ Th: 60.7W @ 27°C Current - Max: 12 A Voltage - Max: 8.61 V Resistance: 560 mOhms Number of Stages: 1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
ATS-11D-96-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X35MM R-TAB T766Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 1.378" (35.00mm) Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.575" (40.00mm) Type: Top Mount Shape: Square, Fins Length: 1.575" (40.00mm) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-NVA2-3554-C3-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK JETSON ORIN NX NANO SUPPackaging: Box Material: Aluminum Alloy Length: 2.264" (57.50mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Nvidia Jetson, Orin NX Attachment Method: Bolt On, Thermal Material Thermal Resistance @ Forced Air Flow: 0.94°C/W @ 200 LFM Thermal Resistance @ Natural: 0.94°C/W Fin Height: 0.905" (23.00mm) Material Finish: Blue Anodized |
auf Bestellung 717 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-NVP-3681-C1-R1 | Advanced Thermal Solutions Inc. |
Description: PLATE NVIDA TTP ORIN NANO/NXPackaging: Box Material: Aluminum Length: 2.480" (63.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Nvidia Jetson Orin Nano, Orin NX Attachment Method: Bolt On, Thermal Material Fin Height: 0.197" (5.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
ATS-10G-39-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 57.9X60.96X5.84MM T766Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.400" (60.96mm) Type: Top Mount Shape: Rectangular, Fins Length: 2.280" (57.90mm) Material: Aluminum Packaging: Bulk Material Finish: Blue Anodized Fin Height: 0.230" (5.84mm) Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
ATS-16A-16-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 54X54X10MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.126" (54.00mm) Type: Top Mount Shape: Square, Fins Length: 2.126" (54.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-13F-13-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X15MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 13.70°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-13F-129-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 60X60X10MM XCUT T766Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.362" (60.00mm) Type: Top Mount Shape: Square, Fins Length: 2.362" (60.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-02B-07-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X12.7MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 17.00°C/W @ 100 LFM Fin Height: 0.500" (12.70mm) Material Finish: Blue Anodized |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
ATS-TEC50-195-185 | Advanced Thermal Solutions Inc. |
Description: TEC Module 50x50x3.3mmPackaging: Box Features: Lead Wires Size / Dimension: Square - 50.00mm L x 50.00mm W Type: TEC (Thermoelectric Cooler) Operating Temperature: 80°C Height: 3.30mm Delta Tmax @ Th: 68°C @ 27°C Qmax @ Th: 200.0W @ 27°C Current - Max: 20 A Voltage - Max: 15.4 V Resistance: 580 mOhms Number of Stages: 1 |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-08B-03-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X15MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 15.85°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-09D-73-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 0.984" (25.00mm) Shape: Square, Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 28.85°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-10A-192-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X35MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 2.35°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-13A-138-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 25X25X15MM L-TAB T766Material Finish: Blue Anodized Fin Height: 0.590" (15.00mm) Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 0.984" (25.00mm) Type: Top Mount Shape: Square, Fins Length: 0.984" (25.00mm) Material: Aluminum Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| ATS-3632-C1-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK FOR INTEL LGA 1700 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| ATS-3633-C1-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK FOR INTEL LGA 1700 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| ATS-3634-C1-R0 | Advanced Thermal Solutions Inc. |
Description: CU HEATSINK FOR INTEL LGA 1700 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| ATS-3635-C1-R0 | Advanced Thermal Solutions Inc. |
Description: CU HEATSINK FOR INTEL LGA 1700 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 100 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||
|
ATS-07B-193-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X6MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM Fin Height: 0.236" (6.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-11B-193-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X6MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM Fin Height: 0.236" (6.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-13B-193-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X6MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM Fin Height: 0.236" (6.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-16B-193-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X6MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM Fin Height: 0.236" (6.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-VC-041-C1-R0 | Advanced Thermal Solutions Inc. |
Description: 100X30X3MM VAPOR CHAMBERPackaging: Box Material: Aluminum Length: 3.937" (100.00mm) Shape: Rectangular Type: Vapor Chamber Width: 1.181" (30.00mm) Operating Temperature: 10°C ~ 60°C Height: 0.118" (3.00mm) Attachment Method: Bolt On Wick Type: Mesh |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-VC-044-C1-R0 | Advanced Thermal Solutions Inc. |
Description: 100X30X4MM VAPOR CHAMBERPackaging: Box Material: Aluminum Length: 3.937" (100.00mm) Shape: Rectangular Type: Vapor Chamber Width: 1.181" (30.00mm) Operating Temperature: 10°C ~ 60°C Height: 0.157" (4.00mm) Attachment Method: Bolt On Wick Type: Mesh |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-04E-197-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X10MM XCUT T766Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.772" (45.00mm) Type: Top Mount Shape: Square, Fins Length: 1.772" (45.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-11H-97-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X10MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 20.30°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-11H-98-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X15MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
ATS-11H-99-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X20MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 11.51°C/W @ 100 LFM Fin Height: 0.790" (20.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-11H-95-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X30MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-11H-96-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X35MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-17C-82-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X25MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 10.79°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-18H-118-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X15MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 6.54°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-21G-208-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 70X70X6MM XCUT T766Packaging: Tray Material: Aluminum Length: 2.756" (70.00mm) Shape: Square, Fins Type: Top Mount, Extrusion Width: 2.756" (70.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 10.50°C/W @ 100 LFM Fin Height: 0.236" (6.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-13A-120-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X25MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 3.48°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-P1-144-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X25MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-P1-145-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X30MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-X53290K-C1-R0 | Advanced Thermal Solutions Inc. |
Description: STR FIN 28.25X28.25X14.5MM T766 Packaging: Bulk |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-13A-123-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X20MM XCUT T766Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM Attachment Method: Push Pin |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-14A-123-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X20MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-19A-123-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X20MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-20A-123-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 50X50X20MM XCUT T766Packaging: Tray Material Finish: Blue Anodized Fin Height: 0.790" (20.00mm) Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.969" (50.00mm) Type: Top Mount Shape: Square, Fins Length: 1.969" (50.00mm) Material: Aluminum |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-18C-101-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X30MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-08B-129-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 60X60X10MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.362" (60.00mm) Type: Top Mount Shape: Square, Fins Length: 2.362" (60.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-10B-129-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 60X60X10MM XCUT T766Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.362" (60.00mm) Type: Top Mount Shape: Square, Fins Length: 2.362" (60.00mm) Material: Aluminum Packaging: Tray Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-13B-129-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 60X60X10MM XCUT T766Material Finish: Blue Anodized Fin Height: 0.394" (10.00mm) Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM Attachment Method: Push Pin Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 2.362" (60.00mm) Type: Top Mount Shape: Square, Fins Length: 2.362" (60.00mm) Material: Aluminum Packaging: Tray |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-HP-F6L70S67W-307 | Advanced Thermal Solutions Inc. |
Description: HEAT PIPE FLAT 4X7.49X70MMPackaging: Bulk Material: Copper Length: 2.756" (70.00mm) Shape: Flat Type: Heat Pipe Width: 0.295" (7.49mm) Operating Temperature: 30°C ~ 120°C Height: 0.157" (4.00mm) Attachment Method: Epoxy or Solder Wick Type: Sintered Power - Cooling: 83.3W @ 70mm |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| ATS-51310D-C0-R0 | Advanced Thermal Solutions Inc. |
Description: HEAT SINK 31X31X9.5MM W/O TIM Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
|
ATS-10C-173-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X30MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM Fin Height: 1.181" (30.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-16E-92-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X15MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 16.48°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-03H-90-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X35MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 6.36°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
ATS-FPX030030025-52-C3-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X25MM L-TAB FPPackaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 10.97°C/W @ 100 LFM Fin Height: 0.984" (25.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-11B-141-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X10MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 15.71°C/W @ 100 LFM Fin Height: 0.394" (10.00mm) Material Finish: Blue Anodized |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 25 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
ATS-11B-57-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 35X35X20MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 13.16°C/W @ 100 LFM Fin Height: 0.790" (20.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-10H-98-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 45X45X15MM R-TAB T766Packaging: Tray Material: Aluminum Length: 1.772" (45.00mm) Shape: Square, Fins Type: Top Mount Width: 1.772" (45.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM Fin Height: 0.590" (15.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-17H-54-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 30X30X35MM L-TAB T766Packaging: Tray Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM Fin Height: 1.378" (35.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
ATS-01F-04-C2-R0 | Advanced Thermal Solutions Inc. |
Description: HEATSINK 40X40X20MM XCUT T766Packaging: Tray Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 11.58°C/W @ 100 LFM Fin Height: 0.790" (20.00mm) Material Finish: Blue Anodized |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ATS-TEC30-36-017 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC MODULE, 30X30X3.6
Number of Stages: 1
Resistance: 3.42 Ohms
Voltage - Max: 15.4 V
Current - Max: 3 A
Qmax @ Th: 26.7W @ 27°C
Delta Tmax @ Th: 68°C @ 27°C
Height: 3.60mm
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires, Sealed - Silicone RTV
Packaging: Bulk
Description: TEC MODULE, 30X30X3.6
Number of Stages: 1
Resistance: 3.42 Ohms
Voltage - Max: 15.4 V
Current - Max: 3 A
Qmax @ Th: 26.7W @ 27°C
Delta Tmax @ Th: 68°C @ 27°C
Height: 3.60mm
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires, Sealed - Silicone RTV
Packaging: Bulk
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.08 EUR |
| 5+ | 30.14 EUR |
| 10+ | 29.35 EUR |
| 30+ | 28.12 EUR |
| 50+ | 27.57 EUR |
| ATS-TEC30-44-082 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3mm
Current - Max: 9 A
Qmax @ Th: 45.5W @ 27°C
Delta Tmax @ Th: 66°C @ 27°C
Height: 3.00mm
Operating Temperature: 80°C
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires
Packaging: Box
Number of Stages: 1
Resistance: 750 mOhms
Voltage - Max: 8.61 V
Description: TEC Module 30x30x3mm
Current - Max: 9 A
Qmax @ Th: 45.5W @ 27°C
Delta Tmax @ Th: 66°C @ 27°C
Height: 3.00mm
Operating Temperature: 80°C
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires
Packaging: Box
Number of Stages: 1
Resistance: 750 mOhms
Voltage - Max: 8.61 V
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.16 EUR |
| 5+ | 32.08 EUR |
| 10+ | 31.23 EUR |
| ATS-TEC30-64-086 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3.2mm
Number of Stages: 1
Resistance: 520 mOhms
Voltage - Max: 8.61 V
Current - Max: 13 A
Qmax @ Th: 65.7W @ 27°C
Delta Tmax @ Th: 66°C @ 27°C
Height: 3.20mm
Operating Temperature: 80°C
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires
Packaging: Box
Description: TEC Module 30x30x3.2mm
Number of Stages: 1
Resistance: 520 mOhms
Voltage - Max: 8.61 V
Current - Max: 13 A
Qmax @ Th: 65.7W @ 27°C
Delta Tmax @ Th: 66°C @ 27°C
Height: 3.20mm
Operating Temperature: 80°C
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires
Packaging: Box
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.44 EUR |
| 5+ | 34.25 EUR |
| 10+ | 33.34 EUR |
| ATS-TEC30-74-084 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3.1mm
Number of Stages: 1
Resistance: 450 mOhms
Voltage - Max: 8.61 V
Current - Max: 15 A
Qmax @ Th: 75.9W @ 27°C
Delta Tmax @ Th: 66°C @ 27°C
Height: 3.10mm
Operating Temperature: 80°C
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires
Packaging: Box
Description: TEC Module 30x30x3.1mm
Number of Stages: 1
Resistance: 450 mOhms
Voltage - Max: 8.61 V
Current - Max: 15 A
Qmax @ Th: 75.9W @ 27°C
Delta Tmax @ Th: 66°C @ 27°C
Height: 3.10mm
Operating Temperature: 80°C
Type: TEC (Thermoelectric Cooler)
Size / Dimension: Square - 30.00mm L x 30.00mm W
Features: Lead Wires
Packaging: Box
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 40.45 EUR |
| 5+ | 38 EUR |
| 10+ | 37 EUR |
| ATS-TEC30-59-085 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 30x30x3.2mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.20mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 60.7W @ 27°C
Current - Max: 12 A
Voltage - Max: 8.61 V
Resistance: 560 mOhms
Number of Stages: 1
Description: TEC Module 30x30x3.2mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 30.00mm L x 30.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.20mm
Delta Tmax @ Th: 66°C @ 27°C
Qmax @ Th: 60.7W @ 27°C
Current - Max: 12 A
Voltage - Max: 8.61 V
Resistance: 560 mOhms
Number of Stages: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-11D-96-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X35MM R-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 1.378" (35.00mm)
Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
Description: HEATSINK 40X40X35MM R-TAB T766
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 1.378" (35.00mm)
Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.575" (40.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.575" (40.00mm)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.14 EUR |
| 10+ | 11.63 EUR |
| 25+ | 11.08 EUR |
| ATS-NVA2-3554-C3-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK JETSON ORIN NX NANO SUP
Packaging: Box
Material: Aluminum Alloy
Length: 2.264" (57.50mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson, Orin NX
Attachment Method: Bolt On, Thermal Material
Thermal Resistance @ Forced Air Flow: 0.94°C/W @ 200 LFM
Thermal Resistance @ Natural: 0.94°C/W
Fin Height: 0.905" (23.00mm)
Material Finish: Blue Anodized
Description: HEATSINK JETSON ORIN NX NANO SUP
Packaging: Box
Material: Aluminum Alloy
Length: 2.264" (57.50mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson, Orin NX
Attachment Method: Bolt On, Thermal Material
Thermal Resistance @ Forced Air Flow: 0.94°C/W @ 200 LFM
Thermal Resistance @ Natural: 0.94°C/W
Fin Height: 0.905" (23.00mm)
Material Finish: Blue Anodized
auf Bestellung 717 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 112.18 EUR |
| 10+ | 99.27 EUR |
| 25+ | 94.55 EUR |
| 50+ | 91.12 EUR |
| 100+ | 87.81 EUR |
| ATS-NVP-3681-C1-R1 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: PLATE NVIDA TTP ORIN NANO/NX
Packaging: Box
Material: Aluminum
Length: 2.480" (63.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson Orin Nano, Orin NX
Attachment Method: Bolt On, Thermal Material
Fin Height: 0.197" (5.00mm)
Material Finish: Black Anodized
Description: PLATE NVIDA TTP ORIN NANO/NX
Packaging: Box
Material: Aluminum
Length: 2.480" (63.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Nvidia Jetson Orin Nano, Orin NX
Attachment Method: Bolt On, Thermal Material
Fin Height: 0.197" (5.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-10G-39-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 57.9X60.96X5.84MM T766
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.400" (60.96mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Blue Anodized
Fin Height: 0.230" (5.84mm)
Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM
Description: HEATSINK 57.9X60.96X5.84MM T766
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.400" (60.96mm)
Type: Top Mount
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Blue Anodized
Fin Height: 0.230" (5.84mm)
Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-16A-16-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 54X54X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 54X54X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.126" (54.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.126" (54.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.85 EUR |
| 10+ | 10.5 EUR |
| 25+ | 10 EUR |
| ATS-13F-13-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X15MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 13.70°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 50X50X15MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 13.70°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.27 EUR |
| 10+ | 9.97 EUR |
| 25+ | 9.5 EUR |
| ATS-13F-129-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X10MM XCUT T766
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Description: HEATSINK 60X60X10MM XCUT T766
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.83 EUR |
| 10+ | 12.23 EUR |
| 25+ | 11.65 EUR |
| ATS-02B-07-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 17.00°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X12.7MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 17.00°C/W @ 100 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Blue Anodized
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-TEC50-195-185 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: TEC Module 50x50x3.3mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 50.00mm L x 50.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.30mm
Delta Tmax @ Th: 68°C @ 27°C
Qmax @ Th: 200.0W @ 27°C
Current - Max: 20 A
Voltage - Max: 15.4 V
Resistance: 580 mOhms
Number of Stages: 1
Description: TEC Module 50x50x3.3mm
Packaging: Box
Features: Lead Wires
Size / Dimension: Square - 50.00mm L x 50.00mm W
Type: TEC (Thermoelectric Cooler)
Operating Temperature: 80°C
Height: 3.30mm
Delta Tmax @ Th: 68°C @ 27°C
Qmax @ Th: 200.0W @ 27°C
Current - Max: 20 A
Voltage - Max: 15.4 V
Resistance: 580 mOhms
Number of Stages: 1
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 96.45 EUR |
| 5+ | 90.59 EUR |
| 10+ | 88.2 EUR |
| 25+ | 85.12 EUR |
| ATS-08B-03-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.85°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.85°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.84 EUR |
| 10+ | 8.71 EUR |
| 25+ | 8.29 EUR |
| ATS-09D-73-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 28.85°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 25X25X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 0.984" (25.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 28.85°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.09 EUR |
| 10+ | 8.03 EUR |
| 25+ | 7.65 EUR |
| ATS-10A-192-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.35°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.35°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.26 EUR |
| 10+ | 11.73 EUR |
| 25+ | 11.17 EUR |
| ATS-13A-138-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 25X25X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 25X25X15MM L-TAB T766
Material Finish: Blue Anodized
Fin Height: 0.590" (15.00mm)
Thermal Resistance @ Forced Air Flow: 12.18°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 0.984" (25.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 0.984" (25.00mm)
Material: Aluminum
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-3632-C1-R0 |
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-3633-C1-R0 |
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-3634-C1-R0 |
Hersteller: Advanced Thermal Solutions Inc.
Description: CU HEATSINK FOR INTEL LGA 1700
Packaging: Tray
Description: CU HEATSINK FOR INTEL LGA 1700
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-3635-C1-R0 |
Hersteller: Advanced Thermal Solutions Inc.
Description: CU HEATSINK FOR INTEL LGA 1700
Packaging: Tray
Description: CU HEATSINK FOR INTEL LGA 1700
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 100 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-07B-193-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.12 EUR |
| 10+ | 8.07 EUR |
| 25+ | 7.68 EUR |
| ATS-11B-193-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.12 EUR |
| 10+ | 8.07 EUR |
| 25+ | 7.68 EUR |
| ATS-13B-193-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.17 EUR |
| 10+ | 8.13 EUR |
| 25+ | 7.74 EUR |
| ATS-16B-193-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 21.10°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.12 EUR |
| 10+ | 8.07 EUR |
| 25+ | 7.68 EUR |
| ATS-VC-041-C1-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: 100X30X3MM VAPOR CHAMBER
Packaging: Box
Material: Aluminum
Length: 3.937" (100.00mm)
Shape: Rectangular
Type: Vapor Chamber
Width: 1.181" (30.00mm)
Operating Temperature: 10°C ~ 60°C
Height: 0.118" (3.00mm)
Attachment Method: Bolt On
Wick Type: Mesh
Description: 100X30X3MM VAPOR CHAMBER
Packaging: Box
Material: Aluminum
Length: 3.937" (100.00mm)
Shape: Rectangular
Type: Vapor Chamber
Width: 1.181" (30.00mm)
Operating Temperature: 10°C ~ 60°C
Height: 0.118" (3.00mm)
Attachment Method: Bolt On
Wick Type: Mesh
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 57.16 EUR |
| ATS-VC-044-C1-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: 100X30X4MM VAPOR CHAMBER
Packaging: Box
Material: Aluminum
Length: 3.937" (100.00mm)
Shape: Rectangular
Type: Vapor Chamber
Width: 1.181" (30.00mm)
Operating Temperature: 10°C ~ 60°C
Height: 0.157" (4.00mm)
Attachment Method: Bolt On
Wick Type: Mesh
Description: 100X30X4MM VAPOR CHAMBER
Packaging: Box
Material: Aluminum
Length: 3.937" (100.00mm)
Shape: Rectangular
Type: Vapor Chamber
Width: 1.181" (30.00mm)
Operating Temperature: 10°C ~ 60°C
Height: 0.157" (4.00mm)
Attachment Method: Bolt On
Wick Type: Mesh
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.44 EUR |
| 10+ | 52.59 EUR |
| ATS-04E-197-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X10MM XCUT T766
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
Description: HEATSINK 45X45X10MM XCUT T766
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.772" (45.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.772" (45.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 100 LFM
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.84 EUR |
| 10+ | 8.71 EUR |
| 25+ | 8.29 EUR |
| ATS-11H-97-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 20.30°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X10MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 20.30°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.52 EUR |
| 10+ | 10.2 EUR |
| 25+ | 9.71 EUR |
| ATS-11H-98-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X15MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X15MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.96 EUR |
| 10+ | 10.58 EUR |
| 25+ | 10.08 EUR |
| ATS-11H-99-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X20MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 11.51°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X20MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 11.51°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.71 EUR |
| 10+ | 11.25 EUR |
| 25+ | 10.71 EUR |
| ATS-11H-95-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.29°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.73 EUR |
| 10+ | 11.27 EUR |
| 25+ | 10.73 EUR |
| ATS-11H-96-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.63°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.14 EUR |
| 10+ | 11.61 EUR |
| 25+ | 11.07 EUR |
| ATS-17C-82-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X25MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.79°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X25MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.79°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.17 EUR |
| 10+ | 9.01 EUR |
| 25+ | 8.58 EUR |
| ATS-18H-118-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.54°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X15MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.54°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.12 EUR |
| 10+ | 8.95 EUR |
| 25+ | 8.52 EUR |
| ATS-21G-208-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 70X70X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.756" (70.00mm)
Shape: Square, Fins
Type: Top Mount, Extrusion
Width: 2.756" (70.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.50°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 70X70X6MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 2.756" (70.00mm)
Shape: Square, Fins
Type: Top Mount, Extrusion
Width: 2.756" (70.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.50°C/W @ 100 LFM
Fin Height: 0.236" (6.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.88 EUR |
| 10+ | 18.48 EUR |
| 25+ | 17.6 EUR |
| ATS-13A-120-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X25MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 3.48°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X25MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 3.48°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.58 EUR |
| 10+ | 9.35 EUR |
| 25+ | 8.91 EUR |
| ATS-P1-144-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X25MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 5.52°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.86 EUR |
| 10+ | 9.62 EUR |
| 25+ | 9.16 EUR |
| 50+ | 8.83 EUR |
| 100+ | 8.51 EUR |
| ATS-P1-145-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X30MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.06 EUR |
| 10+ | 9.79 EUR |
| 25+ | 9.33 EUR |
| 50+ | 9 EUR |
| 100+ | 8.66 EUR |
| ATS-X53290K-C1-R0 |
Hersteller: Advanced Thermal Solutions Inc.
Description: STR FIN 28.25X28.25X14.5MM T766
Packaging: Bulk
Description: STR FIN 28.25X28.25X14.5MM T766
Packaging: Bulk
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.42 EUR |
| 10+ | 24.26 EUR |
| 25+ | 23.11 EUR |
| ATS-13A-123-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X20MM XCUT T766
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
Description: HEATSINK 50X50X20MM XCUT T766
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.97 EUR |
| 10+ | 9.72 EUR |
| 25+ | 9.26 EUR |
| ATS-14A-123-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X20MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 50X50X20MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.97 EUR |
| 10+ | 9.72 EUR |
| 25+ | 9.26 EUR |
| ATS-19A-123-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X20MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 50X50X20MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.97 EUR |
| 10+ | 9.72 EUR |
| 25+ | 9.26 EUR |
| ATS-20A-123-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 50X50X20MM XCUT T766
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
Description: HEATSINK 50X50X20MM XCUT T766
Packaging: Tray
Material Finish: Blue Anodized
Fin Height: 0.790" (20.00mm)
Thermal Resistance @ Forced Air Flow: 4.16°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.969" (50.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.969" (50.00mm)
Material: Aluminum
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.97 EUR |
| 10+ | 9.72 EUR |
| 25+ | 9.26 EUR |
| ATS-18C-101-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.01 EUR |
| 10+ | 12.4 EUR |
| 25+ | 11.82 EUR |
| ATS-08B-129-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 60X60X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.91 EUR |
| 10+ | 12.32 EUR |
| 25+ | 11.73 EUR |
| ATS-10B-129-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X10MM XCUT T766
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
Description: HEATSINK 60X60X10MM XCUT T766
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.91 EUR |
| 10+ | 12.32 EUR |
| 25+ | 11.73 EUR |
| ATS-13B-129-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 60X60X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
Description: HEATSINK 60X60X10MM XCUT T766
Material Finish: Blue Anodized
Fin Height: 0.394" (10.00mm)
Thermal Resistance @ Forced Air Flow: 8.65°C/W @ 100 LFM
Attachment Method: Push Pin
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 2.362" (60.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 2.362" (60.00mm)
Material: Aluminum
Packaging: Tray
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.91 EUR |
| 10+ | 12.32 EUR |
| 25+ | 11.73 EUR |
| ATS-HP-F6L70S67W-307 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEAT PIPE FLAT 4X7.49X70MM
Packaging: Bulk
Material: Copper
Length: 2.756" (70.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.295" (7.49mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.157" (4.00mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Power - Cooling: 83.3W @ 70mm
Description: HEAT PIPE FLAT 4X7.49X70MM
Packaging: Bulk
Material: Copper
Length: 2.756" (70.00mm)
Shape: Flat
Type: Heat Pipe
Width: 0.295" (7.49mm)
Operating Temperature: 30°C ~ 120°C
Height: 0.157" (4.00mm)
Attachment Method: Epoxy or Solder
Wick Type: Sintered
Power - Cooling: 83.3W @ 70mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-51310D-C0-R0 |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEAT SINK 31X31X9.5MM W/O TIM
Packaging: Bulk
Description: HEAT SINK 31X31X9.5MM W/O TIM
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-10C-173-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X30MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Fin Height: 1.181" (30.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.75 EUR |
| 10+ | 9.51 EUR |
| 25+ | 9.06 EUR |
| ATS-16E-92-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X15MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 16.48°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X15MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 16.48°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.19 EUR |
| 10+ | 9.89 EUR |
| 25+ | 9.42 EUR |
| ATS-03H-90-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.36°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 35X35X35MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.36°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.38 EUR |
| 10+ | 10.95 EUR |
| 25+ | 10.42 EUR |
| ATS-FPX030030025-52-C3-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X25MM L-TAB FP
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.97°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X25MM L-TAB FP
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 10.97°C/W @ 100 LFM
Fin Height: 0.984" (25.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.75 EUR |
| 10+ | 5.96 EUR |
| 25+ | 5.69 EUR |
| ATS-11B-141-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.71°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X10MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.71°C/W @ 100 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Blue Anodized
Produkt ist nicht verfügbar
Mindestbestellmenge: 25 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| ATS-11B-57-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 35X35X20MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.16°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 35X35X20MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 13.16°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.89 EUR |
| 10+ | 9.63 EUR |
| 25+ | 9.17 EUR |
| ATS-10H-98-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 45X45X15MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 45X45X15MM R-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.772" (45.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.772" (45.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 15.31°C/W @ 100 LFM
Fin Height: 0.590" (15.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.04 EUR |
| 10+ | 10.65 EUR |
| 25+ | 10.15 EUR |
| ATS-17H-54-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 30X30X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 30X30X35MM L-TAB T766
Packaging: Tray
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 7.00°C/W @ 100 LFM
Fin Height: 1.378" (35.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.46 EUR |
| 10+ | 10.13 EUR |
| 25+ | 9.65 EUR |
| ATS-01F-04-C2-R0 |
![]() |
Hersteller: Advanced Thermal Solutions Inc.
Description: HEATSINK 40X40X20MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 11.58°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
Description: HEATSINK 40X40X20MM XCUT T766
Packaging: Tray
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 11.58°C/W @ 100 LFM
Fin Height: 0.790" (20.00mm)
Material Finish: Blue Anodized
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.16 EUR |
| 10+ | 8.98 EUR |
| 25+ | 8.56 EUR |
























