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XC7VX980T-1FF1930I XC7VX980T-1FF1930I AMD ds183_Virtex_7_Data_Sheet Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX980T-1FFG1930I XC7VX980T-1FFG1930I AMD ds183_Virtex_7_Data_Sheet Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX980T-2FFG1930C XC7VX980T-2FFG1930C AMD ds183_Virtex_7_Data_Sheet Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX980T-L2FFG1930E XC7VX980T-L2FFG1930E AMD ds183_Virtex_7_Data_Sheet Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCF08PFS48C AMD ds123 Description: IC PROM SRL 1.8V 8M GATE 48CSBGA
Packaging: Tray
Package / Case: 48-TFBGA, CSPBGA
Mounting Type: Surface Mount
Memory Size: 8MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 2V
Supplier Device Package: 48-CSP (8x9)
Part Status: Obsolete
Produkt ist nicht verfügbar
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XCF16PFS48C AMD ds123 Description: IC PROM SRL 1.8V 16M 48CSBGA
Packaging: Tray
Package / Case: 48-TFBGA, CSPBGA
Mounting Type: Surface Mount
Memory Size: 16MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 2V
Supplier Device Package: 48-CSP (8x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EFR-DI-CPRI-SITE EFR-DI-CPRI-SITE AMD Description: COMMON PACKET RADIO INTERFACE IP
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-DEINTERLACER-SITE EFR-DI-DEINTERLACER-SITE AMD Description: VIDEO DEINTERLACER IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EK-P7-EMUL-G AMD Description: EPP EMULATION BOARD
Packaging: Bulk
Type: Emulator
Contents: Board(s)
Produkt ist nicht verfügbar
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EK-Z7-ZC706-CES-G AMD Zynq_ZC706_Prod_Brief.pdf Description: ZYNQ-7000 SOC ZC706 EVAL KIT
Packaging: Bulk
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC706 CES PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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EK-Z7-ZC706-CES-G-J AMD Zynq_ZC706_Prod_Brief.pdf Description: ZYNQ-7000 SOC ZC706 EVAL KIT
Packaging: Bulk
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC706 CES Japan PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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EFR-DI-10-100-EMAC-SITE EFR-DI-10-100-EMAC-SITE AMD Description: 10/100 ETHERNET MAC IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-10GEMAC-PROJ EFR-DI-10GEMAC-PROJ AMD Description: 10 GIGABIT ETHERNET MAC IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-10GEMAC-SITE EFR-DI-10GEMAC-SITE AMD Description: 10 GIGABIT ETHERNET MAC IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-OSD-SITE EFR-DI-OSD-SITE AMD Description: ON-SCREEN DISPLAY IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-PCI32-SP-PROJ EFR-DI-PCI32-SP-PROJ AMD Description: 32BIT INITIATOR/TARGET SPARTAN
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-RSD-SITE EFR-DI-RSD-SITE AMD Description: REED SOLOMON DECODER IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EFR-DI-RSE-SITE EFR-DI-RSE-SITE AMD Description: REED SOLOMON ENCODER IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EFR-DI-GAMMA-SITE EFR-DI-GAMMA-SITE AMD Description: GAMMA CORRECTION IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-IMG-NOISE-SITE EFR-DI-IMG-NOISE-SITE AMD Description: IMAGE NOISE REDUCTION IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-IMG-STATS-SITE EFR-DI-IMG-STATS-SITE AMD Description: IMAGE STATISTICS ENGINE IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-INTERLEAV-SITE EFR-DI-INTERLEAV-SITE AMD Description: INTERLEAVER/DE-INTERLEAVER IP
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC2S50E-6PQ208I XC2S50E-6PQ208I AMD XC2S50E%2C%20100E%2C%20150E%2C%20200E%2C%20300E%2C%20400E%2C%20600E.pdf Description: IC FPGA 146 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 384
Total RAM Bits: 32768
Number of I/O: 146
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC2S200-6FGG256C XC2S200-6FGG256C AMD ds001 Description: IC FPGA 176 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Number of I/O: 176
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EK-Z7-ZC702-G-J AMD xtp310-zc702-quickstart.pdf Description: ZYNQ-7000 ZC702 EVAL KIT
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC702 Japan
Part Status: Active
Utilized IC / Part: XC7Z020
Produkt ist nicht verfügbar
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EK-Z7-ZC702-G EK-Z7-ZC702-G AMD xtp310-zc702-quickstart.pdf Description: ZYNQ-7000 ZC702 EVAL KIT
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC702
Part Status: Active
Utilized IC / Part: XC7Z020
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
1+1920.65 EUR
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EK-Z7-ZC706-G-J AMD Zynq_ZC706_Prod_Brief.pdf Description: EVAL KIT ZYNQ-7000 ZC706
Packaging: Box
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC706 Japan PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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EK-Z7-ZC706-G EK-Z7-ZC706-G AMD Zynq_ZC706_Prod_Brief.pdf Description: EVALUATION KIT ZYNQ-7000 ZC706
Packaging: Box
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC706 PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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DK-Z7-VIDEO-G AMD unresolved?Doc_Version=14_5%20English&url=UG926_Z7_ZC702_Eval_Kit Description: EVAL KIT ZYNQ-7000 SOC ZC702
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC702 Video and Imaging
Part Status: Obsolete
Produkt ist nicht verfügbar
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DK-Z7-VIDEO-G-J AMD unresolved?Doc_Version=14_5%20English&url=UG926_Z7_ZC702_Eval_Kit Description: EVAL KIT ZYNQ-7000 SOC ZC702
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC702 Video and Imaging Japan
Part Status: Obsolete
Produkt ist nicht verfügbar
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EF-VIVADO-DEBUG-NL AMD Vivado ISE-Design Suite Install & Licensing Guide.pdf Description: VIVADO DEBUG NODE-LOCKED LICENSE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Debugger
Applications: Programming
Operating System: Linux, Windows
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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UEF-VIVADO-DESIGN-25 UEF-VIVADO-DESIGN-25 AMD kluQRHH2MabKs5cfFYUQmg Description: VIVADO DESIGN SUITE UNIVERSITY
Packaging: Bulk
Type: Integrated Software Environment (ISE)
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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UEF-VIVADO-SYSTEM-50 AMD irn.pdf Description: VIVADO SYSTEM SUITE UNIVERSITY
Packaging: Bulk
Type: Integrated Software Environment (ISE)
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
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DO-VIVADO-DEBUG-USB-II-G-NL AMD Vivado ISE-Design Suite Install & Licensing Guide.pdf Description: VIVADO DEBUG NODE-LOCKED LICENSE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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UEF-VIVADO-SYSTEM-25 AMD Description: VIVADO SYSTEM SUITE UNIVERSITY
Packaging: Electronic Delivery
Type: Integrated Software Environment (ISE)
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC7Z015-1CLG485C XC7Z015-1CLG485C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 97 Stücke:
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1+228.03 EUR
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XC7Z015-1CLG485I XC7Z015-1CLG485I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 113 Stücke:
Lieferzeit 10-14 Tag (e)
1+262.22 EUR
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XC7Z015-2CLG485E XC7Z015-2CLG485E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
1+285.01 EUR
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XC7Z015-2CLG485I XC7Z015-2CLG485I AMD ds187-XC7Z010-XC7Z020-Data-Sheet Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+314.21 EUR
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XC7Z015-3CLG485E XC7Z015-3CLG485E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 866MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 866MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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5962-9957301NUA AMD uYEt5IDOmTIsp849tjMIsQ Description: IC FPGA 316 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 661111
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 15552
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 3456
Total RAM Bits: 98304
Part Status: Obsolete
Number of I/O: 316
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5962-9957201NUA AMD uYEt5IDOmTIsp849tjMIsQ Description: IC FPGA 316 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 322970
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 6912
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1536
Total RAM Bits: 65536
Part Status: Obsolete
Number of I/O: 316
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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5962-9957201NNA AMD uYEt5IDOmTIsp849tjMIsQ Description: IC FPGA 260 I/O 352MBGA
Packaging: Tray
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 322970
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 6912
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1536
Total RAM Bits: 65536
Part Status: Obsolete
Number of I/O: 260
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EF-AXI-BFM EF-AXI-BFM AMD Description: LICENSE AXI BUS FUNCTIONAL MOD
Packaging: Electronic Delivery
Type: License
Utilized IC / Part: Xilinx
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XCR3128XL-10VQG100I XCR3128XL-10VQG100I AMD lH2m~1k07ZGb9b5CfB_19A Description: IC CPLD 128MC 9.1NS 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 3000
Number of Macrocells: 128
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 84
DigiKey Programmable: Verified
auf Bestellung 16916 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.93 EUR
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XCR3256XL-12TQG144C XCR3256XL-12TQG144C AMD ds013 Description: IC CPLD 256MC 10.8NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 11868 Stücke:
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XCMECH-FF1152 XCMECH-FF1152 AMD DevicePkg_UG.pdf Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1152-FCBGA (35x35)
Part Status: Active
Produkt ist nicht verfügbar
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XCMECH-FF1513 XCMECH-FF1513 AMD DevicePkg_UG.pdf Description: IC MECHANICAL SAMPLE 1513-FCBGA
Packaging: Tray
Package / Case: 1513-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1513-FCBGA (40x40)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCMECH-FF1517 XCMECH-FF1517 AMD DevicePkg_UG.pdf Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1517-FCBGA (40x40)
Part Status: Active
Produkt ist nicht verfügbar
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XCMECH-FFG1513 XCMECH-FFG1513 AMD DevicePkg_UG.pdf Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1513-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1513-FCBGA (40x40)
Part Status: Active
Produkt ist nicht verfügbar
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XCMECH-FFG1517 XCMECH-FFG1517 AMD DevicePkg_UG.pdf Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1517-FCBGA (40x40)
Part Status: Active
Produkt ist nicht verfügbar
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XC7A50T-1FTG256C XC7A50T-1FTG256C AMD ds180_7Series_Overview Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 170
DigiKey Programmable: Not Verified
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XC7A50T-2FTG256I XC7A50T-2FTG256I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 170
DigiKey Programmable: Not Verified
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XC7A75T-2FTG256I XC7A75T-2FTG256I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 170
DigiKey Programmable: Not Verified
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XC7Z030-1SBG485C XC7Z030-1SBG485C AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 667MHZ 485FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z030-2SBG485I XC7Z030-2SBG485I AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 800MHZ 485FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z030-3SBG485E XC7Z030-3SBG485E AMD ds190-Zynq-7000-Overview Description: IC SOC CORTEX-A9 1GHZ 485FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Speed: 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XA6SLX45-2CSG484I XA6SLX45-2CSG484I AMD ds170 Description: IC FPGA 320 I/O 484CSBGA
Packaging: Tray
Package / Case: 484-FBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 43661
Supplier Device Package: 484-CSPBGA (19x19)
Number of LABs/CLBs: 3411
Total RAM Bits: 2138112
Grade: Automotive
Number of I/O: 320
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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XA7Z010-1CLG225Q XA7Z010-1CLG225Q AMD ds188-XA-Zynq-7000-Overview.pdf Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
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XA7Z010-1CLG400I XA7Z010-1CLG400I AMD ds188-XA-Zynq-7000-Overview.pdf Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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XC7VX980T-1FF1930I ds183_Virtex_7_Data_Sheet
XC7VX980T-1FF1930I
Hersteller: AMD
Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX980T-1FFG1930I ds183_Virtex_7_Data_Sheet
XC7VX980T-1FFG1930I
Hersteller: AMD
Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX980T-2FFG1930C ds183_Virtex_7_Data_Sheet
XC7VX980T-2FFG1930C
Hersteller: AMD
Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC7VX980T-L2FFG1930E ds183_Virtex_7_Data_Sheet
XC7VX980T-L2FFG1930E
Hersteller: AMD
Description: IC FPGA 900 I/O 1930FCBGA
Packaging: Tray
Package / Case: 1924-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 979200
Supplier Device Package: 1930-FCBGA (45x45)
Number of LABs/CLBs: 76500
Total RAM Bits: 55296000
Number of I/O: 900
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCF08PFS48C ds123
Hersteller: AMD
Description: IC PROM SRL 1.8V 8M GATE 48CSBGA
Packaging: Tray
Package / Case: 48-TFBGA, CSPBGA
Mounting Type: Surface Mount
Memory Size: 8MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 2V
Supplier Device Package: 48-CSP (8x9)
Part Status: Obsolete
Produkt ist nicht verfügbar
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XCF16PFS48C ds123
Hersteller: AMD
Description: IC PROM SRL 1.8V 16M 48CSBGA
Packaging: Tray
Package / Case: 48-TFBGA, CSPBGA
Mounting Type: Surface Mount
Memory Size: 16MB
Programmable Type: In System Programmable
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 2V
Supplier Device Package: 48-CSP (8x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EFR-DI-CPRI-SITE
EFR-DI-CPRI-SITE
Hersteller: AMD
Description: COMMON PACKET RADIO INTERFACE IP
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-DEINTERLACER-SITE
EFR-DI-DEINTERLACER-SITE
Hersteller: AMD
Description: VIDEO DEINTERLACER IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EK-P7-EMUL-G
Hersteller: AMD
Description: EPP EMULATION BOARD
Packaging: Bulk
Type: Emulator
Contents: Board(s)
Produkt ist nicht verfügbar
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EK-Z7-ZC706-CES-G Zynq_ZC706_Prod_Brief.pdf
Hersteller: AMD
Description: ZYNQ-7000 SOC ZC706 EVAL KIT
Packaging: Bulk
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC706 CES PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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EK-Z7-ZC706-CES-G-J Zynq_ZC706_Prod_Brief.pdf
Hersteller: AMD
Description: ZYNQ-7000 SOC ZC706 EVAL KIT
Packaging: Bulk
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC706 CES Japan PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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EFR-DI-10-100-EMAC-SITE
EFR-DI-10-100-EMAC-SITE
Hersteller: AMD
Description: 10/100 ETHERNET MAC IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-10GEMAC-PROJ
EFR-DI-10GEMAC-PROJ
Hersteller: AMD
Description: 10 GIGABIT ETHERNET MAC IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-10GEMAC-SITE
EFR-DI-10GEMAC-SITE
Hersteller: AMD
Description: 10 GIGABIT ETHERNET MAC IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-OSD-SITE
EFR-DI-OSD-SITE
Hersteller: AMD
Description: ON-SCREEN DISPLAY IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-PCI32-SP-PROJ
EFR-DI-PCI32-SP-PROJ
Hersteller: AMD
Description: 32BIT INITIATOR/TARGET SPARTAN
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Project
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-RSD-SITE
EFR-DI-RSD-SITE
Hersteller: AMD
Description: REED SOLOMON DECODER IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EFR-DI-RSE-SITE
EFR-DI-RSE-SITE
Hersteller: AMD
Description: REED SOLOMON ENCODER IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Xilinx
Produkt ist nicht verfügbar
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EFR-DI-GAMMA-SITE
EFR-DI-GAMMA-SITE
Hersteller: AMD
Description: GAMMA CORRECTION IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-IMG-NOISE-SITE
EFR-DI-IMG-NOISE-SITE
Hersteller: AMD
Description: IMAGE NOISE REDUCTION IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-IMG-STATS-SITE
EFR-DI-IMG-STATS-SITE
Hersteller: AMD
Description: IMAGE STATISTICS ENGINE IP CORE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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EFR-DI-INTERLEAV-SITE
EFR-DI-INTERLEAV-SITE
Hersteller: AMD
Description: INTERLEAVER/DE-INTERLEAVER IP
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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XC2S50E-6PQ208I XC2S50E%2C%20100E%2C%20150E%2C%20200E%2C%20300E%2C%20400E%2C%20600E.pdf
XC2S50E-6PQ208I
Hersteller: AMD
Description: IC FPGA 146 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 384
Total RAM Bits: 32768
Number of I/O: 146
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC2S200-6FGG256C ds001
XC2S200-6FGG256C
Hersteller: AMD
Description: IC FPGA 176 I/O 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Number of I/O: 176
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EK-Z7-ZC702-G-J xtp310-zc702-quickstart.pdf
Hersteller: AMD
Description: ZYNQ-7000 ZC702 EVAL KIT
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC702 Japan
Part Status: Active
Utilized IC / Part: XC7Z020
Produkt ist nicht verfügbar
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EK-Z7-ZC702-G xtp310-zc702-quickstart.pdf
EK-Z7-ZC702-G
Hersteller: AMD
Description: ZYNQ-7000 ZC702 EVAL KIT
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC702
Part Status: Active
Utilized IC / Part: XC7Z020
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1920.65 EUR
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EK-Z7-ZC706-G-J Zynq_ZC706_Prod_Brief.pdf
Hersteller: AMD
Description: EVAL KIT ZYNQ-7000 ZC706
Packaging: Box
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC706 Japan PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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EK-Z7-ZC706-G Zynq_ZC706_Prod_Brief.pdf
EK-Z7-ZC706-G
Hersteller: AMD
Description: EVALUATION KIT ZYNQ-7000 ZC706
Packaging: Box
For Use With/Related Products: XC7Z045
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC706 PCIe Card
Utilized IC / Part: XC7Z045
Produkt ist nicht verfügbar
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DK-Z7-VIDEO-G unresolved?Doc_Version=14_5%20English&url=UG926_Z7_ZC702_Eval_Kit
Hersteller: AMD
Description: EVAL KIT ZYNQ-7000 SOC ZC702
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq-7000 AP SoC ZC702 Video and Imaging
Part Status: Obsolete
Produkt ist nicht verfügbar
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DK-Z7-VIDEO-G-J unresolved?Doc_Version=14_5%20English&url=UG926_Z7_ZC702_Eval_Kit
Hersteller: AMD
Description: EVAL KIT ZYNQ-7000 SOC ZC702
Packaging: Box
For Use With/Related Products: XC7Z020
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq-7000 AP SoC ZC702 Video and Imaging Japan
Part Status: Obsolete
Produkt ist nicht verfügbar
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EF-VIVADO-DEBUG-NL Vivado ISE-Design Suite Install & Licensing Guide.pdf
Hersteller: AMD
Description: VIVADO DEBUG NODE-LOCKED LICENSE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Debugger
Applications: Programming
Operating System: Linux, Windows
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
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UEF-VIVADO-DESIGN-25 kluQRHH2MabKs5cfFYUQmg
UEF-VIVADO-DESIGN-25
Hersteller: AMD
Description: VIVADO DESIGN SUITE UNIVERSITY
Packaging: Bulk
Type: Integrated Software Environment (ISE)
Part Status: Discontinued at Digi-Key
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UEF-VIVADO-SYSTEM-50 irn.pdf
Hersteller: AMD
Description: VIVADO SYSTEM SUITE UNIVERSITY
Packaging: Bulk
Type: Integrated Software Environment (ISE)
Part Status: Discontinued at Digi-Key
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DO-VIVADO-DEBUG-USB-II-G-NL Vivado ISE-Design Suite Install & Licensing Guide.pdf
Hersteller: AMD
Description: VIVADO DEBUG NODE-LOCKED LICENSE
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
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UEF-VIVADO-SYSTEM-25
Hersteller: AMD
Description: VIVADO SYSTEM SUITE UNIVERSITY
Packaging: Electronic Delivery
Type: Integrated Software Environment (ISE)
Media Delivery Type: Electronically Delivered
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XC7Z015-1CLG485C ds190-Zynq-7000-Overview
XC7Z015-1CLG485C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z015-1CLG485I ds190-Zynq-7000-Overview
XC7Z015-1CLG485I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z015-2CLG485E ds190-Zynq-7000-Overview
XC7Z015-2CLG485E
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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XC7Z015-2CLG485I ds187-XC7Z010-XC7Z020-Data-Sheet
XC7Z015-2CLG485I
Hersteller: AMD
Description: IC SOC CORTEX-A9 766MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 766MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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1+314.21 EUR
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XC7Z015-3CLG485E ds190-Zynq-7000-Overview
XC7Z015-3CLG485E
Hersteller: AMD
Description: IC SOC CORTEX-A9 866MHZ 485CSBGA
Packaging: Tray
Package / Case: 485-LFBGA, CSPBGA
Speed: 866MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 74K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 485-CSPBGA (19x19)
Architecture: MCU, FPGA
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5962-9957301NUA uYEt5IDOmTIsp849tjMIsQ
Hersteller: AMD
Description: IC FPGA 316 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 661111
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 15552
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 3456
Total RAM Bits: 98304
Part Status: Obsolete
Number of I/O: 316
DigiKey Programmable: Not Verified
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5962-9957201NUA uYEt5IDOmTIsp849tjMIsQ
Hersteller: AMD
Description: IC FPGA 316 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 322970
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 6912
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1536
Total RAM Bits: 65536
Part Status: Obsolete
Number of I/O: 316
DigiKey Programmable: Not Verified
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5962-9957201NNA uYEt5IDOmTIsp849tjMIsQ
Hersteller: AMD
Description: IC FPGA 260 I/O 352MBGA
Packaging: Tray
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 322970
Operating Temperature: -55°C ~ 125°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 6912
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1536
Total RAM Bits: 65536
Part Status: Obsolete
Number of I/O: 260
DigiKey Programmable: Not Verified
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EF-AXI-BFM
EF-AXI-BFM
Hersteller: AMD
Description: LICENSE AXI BUS FUNCTIONAL MOD
Packaging: Electronic Delivery
Type: License
Utilized IC / Part: Xilinx
Media Delivery Type: Electronically Delivered
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XCR3128XL-10VQG100I lH2m~1k07ZGb9b5CfB_19A
XCR3128XL-10VQG100I
Hersteller: AMD
Description: IC CPLD 128MC 9.1NS 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 3000
Number of Macrocells: 128
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 2.7V ~ 3.6V
Number of I/O: 84
DigiKey Programmable: Verified
auf Bestellung 16916 Stücke:
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1+48.93 EUR
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XCR3256XL-12TQG144C ds013
XCR3256XL-12TQG144C
Hersteller: AMD
Description: IC CPLD 256MC 10.8NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 1K program/erase cycles)
Number of Gates: 6000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10.8 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 11868 Stücke:
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1+73.55 EUR
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XCMECH-FF1152 DevicePkg_UG.pdf
XCMECH-FF1152
Hersteller: AMD
Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1152-FCBGA (35x35)
Part Status: Active
Produkt ist nicht verfügbar
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XCMECH-FF1513 DevicePkg_UG.pdf
XCMECH-FF1513
Hersteller: AMD
Description: IC MECHANICAL SAMPLE 1513-FCBGA
Packaging: Tray
Package / Case: 1513-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1513-FCBGA (40x40)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XCMECH-FF1517 DevicePkg_UG.pdf
XCMECH-FF1517
Hersteller: AMD
Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1517-FCBGA (40x40)
Part Status: Active
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XCMECH-FFG1513 DevicePkg_UG.pdf
XCMECH-FFG1513
Hersteller: AMD
Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1513-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1513-FCBGA (40x40)
Part Status: Active
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XCMECH-FFG1517 DevicePkg_UG.pdf
XCMECH-FFG1517
Hersteller: AMD
Description: IC MECHANICAL SAMPLE
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Type: Mechanical Sample
Supplier Device Package: 1517-FCBGA (40x40)
Part Status: Active
Produkt ist nicht verfügbar
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XC7A50T-1FTG256C ds180_7Series_Overview
XC7A50T-1FTG256C
Hersteller: AMD
Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 170
DigiKey Programmable: Not Verified
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Anzahl Preis
1+104.1 EUR
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XC7A50T-2FTG256I ds181_Artix_7_Data_Sheet
XC7A50T-2FTG256I
Hersteller: AMD
Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 170
DigiKey Programmable: Not Verified
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1+137.7 EUR
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XC7A75T-2FTG256I ds181_Artix_7_Data_Sheet
XC7A75T-2FTG256I
Hersteller: AMD
Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 170
DigiKey Programmable: Not Verified
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Anzahl Preis
1+221.78 EUR
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XC7Z030-1SBG485C ds190-Zynq-7000-Overview
XC7Z030-1SBG485C
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 485FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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Anzahl Preis
1+434.05 EUR
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XC7Z030-2SBG485I ds190-Zynq-7000-Overview
XC7Z030-2SBG485I
Hersteller: AMD
Description: IC SOC CORTEX-A9 800MHZ 485FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
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Anzahl Preis
1+620.65 EUR
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XC7Z030-3SBG485E ds190-Zynq-7000-Overview
XC7Z030-3SBG485E
Hersteller: AMD
Description: IC SOC CORTEX-A9 1GHZ 485FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Speed: 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
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XA6SLX45-2CSG484I ds170
XA6SLX45-2CSG484I
Hersteller: AMD
Description: IC FPGA 320 I/O 484CSBGA
Packaging: Tray
Package / Case: 484-FBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 43661
Supplier Device Package: 484-CSPBGA (19x19)
Number of LABs/CLBs: 3411
Total RAM Bits: 2138112
Grade: Automotive
Number of I/O: 320
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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Anzahl Preis
1+242.56 EUR
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XA7Z010-1CLG225Q ds188-XA-Zynq-7000-Overview.pdf
XA7Z010-1CLG225Q
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 225BGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 225-CSPBGA (13x13)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
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Anzahl Preis
1+159.67 EUR
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XA7Z010-1CLG400I ds188-XA-Zynq-7000-Overview.pdf
XA7Z010-1CLG400I
Hersteller: AMD
Description: IC SOC CORTEX-A9 667MHZ 400BGA
Packaging: Tray
Package / Case: 400-LFBGA, CSPBGA
Speed: 667MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 400-CSPBGA (17x17)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
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